Reliability of ICA attachment of SMDs on inkjet-printed substrates

Microelectronics Reliability

Volumn 52, Issue 11, 2012, Pages 2709-2715

  Niittynen, Juha ^a   Kiilunen, Janne ^a   Putaala, Jussi ^b   Pekkanen, Ville ^a   Mäntysalo, Matti ^a   Jantunen, Heli ^b   Lupo, Donald ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b UNIVERSITY OF OULU   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ALL-PRINTED; ELECTRICAL DEVICES; EXTERNAL COMPONENTS; FLEXIBLE PRODUCTION; FLEXIBLE SUBSTRATE; ISOTROPICALLY CONDUCTIVE ADHESIVES; MECHANICAL PERFORMANCE; PRINTABLE ELECTRONICS; PRINTED STRUCTURES; PRODUCTION PROCESS; SEMICONDUCTIVE;

MAGNETIC MATERIALS; MICROELECTRONICS;

FLEXIBLE ELECTRONICS;

EID: 84867574981     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.05.001     Document Type: Article

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