Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material

Thin Solid Films

Volumn 517, Issue 16, 2009, Pages 4633-4637

  Sridhar, A ^a   van Dijk, D J ^a   Akkerman, R ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

Inkjet printing; Nanoparticles; Printed circuit board; Pull off test

Indexed keywords

ADHESIVE STRENGTHS; CHARACTERISATION; DROP ON DEMANDS; E GLASS; INK-JET PRINTERS; INKJET PRINTING; LOCAL GEOMETRIES; PULL-OFF ADHESION TESTS; PULL-OFF TEST; SCANNING ELECTRON MICROSCOPES; SILVER NANOPARTICLES; SUBSTRATE MATERIALS;

ADHESION; ELECTROMAGNETIC WAVE EMISSION; ENGINEERING GEOLOGY; GLASS FIBERS; NANOPARTICLES; PRINTED CIRCUIT MANUFACTURE; PRINTERS (COMPUTER); PRINTING; PRINTING PRESSES; SCANNING ELECTRON MICROSCOPY; SILVER; SUBSTRATES; SURFACE TOPOGRAPHY; TESTING;

PRINTED CIRCUIT BOARDS;

EID: 65149083819     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.03.133     Document Type: Article

References (15)

1. Liu Y., Cui T., and Varahramyan K. Solid-State Electron. 47 (2003) 1543
2. Redinger D., Molesa S., Yin S., Farschi R., and Subramanian V. IEEE Trans. Electron Devices 51 (2004) 1978
3. Tekin E., de Gans B.-J., and Schubert U.S. J. Mater. Chem. 14 (2004) 2627
4. Yoshioka Y., Calvert P.D., and Jabbour G.E. Macromol. Rapid Commun. 26 (2005) 238
5. Liu Y., and Cui T. Macromol. Rapid Commun. 26 (2005) 289
6. van Osch T.H.J., Perelaer J., de Laat A.W.M., and Schubert U.S. Adv. Mater. 20 (2008) 343
7. Paints and Varnishes - Pull-Off Test for Adhesion, ISO 4624:2002 (2002)
8. Wallace D.B., Shah V., Hayes D.J., and Grove M.E. J. Imaging Sci. Technol. 40 (1996) 390
9. Hope R.L., Noth R.N., and Jacobs P.A. Rapid Prototyping J. 3 (1997) 89
10. Turunen M.P.K., Marjamaki P., Paajanen M., Lahtinen J., and Kivilahti J.K. Microelectron. Reliab. 44 (2004) 993
11. J.J. Howarth, C. Edwards, K. Vanheusden, U.S. Patent Application Publication No. US 2006/0176350 A1, 10 Aug. 2006.
12. Sridhar A., van Dijk D.J., and Akkerman R. Proceedings of the EIPC Winter Conference, Rome, Italy, January 24-25 (2008)
13. de Gans B.J., Duineveld P.C., and Schubert U.S. Adv. Mater. 16 (2004) 203
14. Ge J., Tuominen R., and Kivilahti J.K. J. Adhes. Sci. Technol. 15 (2001) 1133
15. Wu S.P., Yung K.C., Xu L.H., and Ding X.H. IEEE Trans. Electron. Packag. Manuf. 31 (2008) 291