Preparation and evaluation of particleboard bonded with a soy flour-based adhesive with a new curing agent

Journal of Adhesion Science and Technology

Volumn 27, Issue 18-19, 2013, Pages 2053-2064

  Gu, Kai ^a   Huang, Jian ^a   Li, Kaichang ^a  

^a OREGON STATE UNIVERSITY   (United States)

Author keywords

crosslinking; curing agent; particleboard; soy flour; wood adhesive

Indexed keywords

CURING AGENTS; HOT-PRESS TEMPERATURE; INDUSTRIAL REQUIREMENTS; INTERNAL BOND STRENGTHS; MODULUS OF RUPTURE; SOY FLOUR; UREA FORMALDEHYDE; WOOD ADHESIVES;

CROSSLINKING; CURING; FORMALDEHYDE; PRESSES (MACHINE TOOLS);

PARTICLE BOARD;

EID: 84882368711     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1080/01694243.2012.696950     Document Type: Article

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