A new method of making particleboard with a formaldehyde-free soy-based adhesive

Composites Part A: Applied Science and Manufacturing

Volumn 41, Issue 10, 2010, Pages 1447-1453

  Prasittisopin, Lapyote ^a   Li, Kaichang ^a  

^a Oregon State University   (United States)

Author keywords

A. Thermosetting resin; A. Wood; B. Adhesion; B. Mechanical properties

Indexed keywords

A. WOOD; B. ADHESION; B. MECHANICAL PROPERTIES; CURING AGENTS; HIGH VISCOSITIES; HOT-PRESS TEMPERATURE; INTERNAL BONDS; MODULUS OF ELASTICITY; MODULUS OF RUPTURE; MOISTURE CONTENTS; SOLIDS CONTENT; SOY FLOUR; STORAGE TIME; THERMOSETTING RESINS; WEIGHT RATIOS; WOOD PARTICLES;

ADHESION; CURING; FORMALDEHYDE; PARTICLE BOARD; PRESSES (MACHINE TOOLS); RESINS; THERMOSETS; WOOD;

MECHANICAL PROPERTIES;

ADHESION; CURING; FORMALDEHYDE; MECHANICAL PROPERTIES; PARTICLE BOARDS; PRESSES; WOOD;

EID: 78049432830     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2010.06.006     Document Type: Article

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