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Volumn 113-116, Issue , 2010, Pages 2007-2011

Investigation of soybean/PF resin based adhesive applying on plywood

Author keywords

Bonding strength; Formaldehyde emission; PF resin; Plywood; Soy

Indexed keywords

BONDING STRENGTH; CHINESE STANDARD; ENVIRONMENTAL-FRIENDLY; FORMALDEHYDE EMISSION; HOT PRESSING TEMPERATURE; PF RESIN; PRESSING TIME; PRESSURE INTENSITY; SOY; THERMAL BEHAVIORS; WOOD COMPOSITES;

EID: 78650767964     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.113-116.2007     Document Type: Conference Paper
Times cited : (13)

References (9)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.