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Volumn 113-116, Issue , 2010, Pages 2007-2011
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Investigation of soybean/PF resin based adhesive applying on plywood
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Author keywords
Bonding strength; Formaldehyde emission; PF resin; Plywood; Soy
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Indexed keywords
BONDING STRENGTH;
CHINESE STANDARD;
ENVIRONMENTAL-FRIENDLY;
FORMALDEHYDE EMISSION;
HOT PRESSING TEMPERATURE;
PF RESIN;
PRESSING TIME;
PRESSURE INTENSITY;
SOY;
THERMAL BEHAVIORS;
WOOD COMPOSITES;
DIFFUSION BONDING;
ENVIRONMENTAL MANAGEMENT;
FORMALDEHYDE;
HOT PRESSING;
MANUFACTURE;
PLYWOOD;
RESINS;
WOOD PRODUCTS;
ADHESIVES;
BONDING STRENGTH;
FORMALDEHYDE;
HOT PRESSING;
MANUFACTURE;
PLY WOOD;
SOYA FLOUR;
SYNTHETIC POLYMERS;
WOOD PRODUCTS;
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EID: 78650767964
PISSN: 10226680
EISSN: None
Source Type: Book Series
DOI: 10.4028/www.scientific.net/AMR.113-116.2007 Document Type: Conference Paper |
Times cited : (13)
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References (9)
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