Preparation and evaluation of particleboard with a soy flour- polyethylenimine-maleic anhydride adhesive

JAOCS, Journal of the American Oil Chemists' Society

Volumn 88, Issue 5, 2011, Pages 673-679

  Gu, Kai ^a   Li, Kaichang ^a  

^a OREGON STATE UNIVERSITY   (United States)

Author keywords

Particleboard; Polyethylenimine; Soy flour; Wood adhesive

Indexed keywords

CORE PARTICLES; HOT-PRESS TEMPERATURE; INDUSTRIAL REQUIREMENTS; INTERNAL BONDS; MODULUS OF RUPTURE; POLYETHYLENIMINES; SOY FLOUR; SURFACE PARTICLES; THREE-LAYER; WEIGHT RATIOS; WOOD ADHESIVE;

MALEIC ANHYDRIDE; PRESSES (MACHINE TOOLS);

PARTICLE BOARD;

GLYCINE MAX;

EID: 79958786811     PISSN: 0003021X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11746-010-1706-7     Document Type: Article

References (7)

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