Molecular dynamics simulation for the bonding energy of metal-SWNT interface

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2011, Pages 506-509

  Zhang, Yahui ^a   Hu, Zhili ^a,b   Zhang, Yan ^a   Ye, Lilei ^c   Liu, Johan ^a,b  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION ENERGY; BONDING ENERGIES; BREAKING FORCE; MOLECULAR DYNAMICS SIMULATIONS; TENSILE-LOADING TESTS;

ADHESION; DYNAMICS; ELECTRONICS PACKAGING; GOLD; METALS; MOLECULAR MECHANICS; PACKAGING;

MOLECULAR DYNAMICS;

EID: 81355132001     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2011.6066886     Document Type: Conference Paper

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