Thermoelectric property enhancement by Cu nanoparticles in nanostructured FeSb2

Applied Physics Letters

Volumn 102, Issue 21, 2013, Pages

  Koirala, Machhindra ^a   Zhao, Huaizhou ^a   Pokharel, Mani ^b   Chen, Shuo ^a   Dahal, Tulashi ^a   Opeil, Cyril ^b   Chen, Gang ^c   Ren, Zhifeng ^a  

^a University of Houston   (United States)

^b BOSTON COLLEGE   (United States)

^c Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIMONY COMPOUNDS; CARRIER CONCENTRATION; COPPER; ELECTRIC CONDUCTIVITY; HALL MOBILITY; HOLE MOBILITY; MODULATION; NANOCOMPOSITES; NANOPARTICLES; THERMAL CONDUCTIVITY; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY;

CU NANO-PARTICLES; HIGH ELECTRICAL CONDUCTIVITY; KONDO INSULATORS; MODULATION DOPING; THERMO-ELECTRIC MATERIALS; THERMOELECTRIC FIGURE OF MERIT; THERMOELECTRIC PERFORMANCE; THERMOELECTRIC PROPERTIES;

IRON COMPOUNDS;

EID: 84879075601     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4808094     Document Type: Article

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