-
1
-
-
78649443497
-
Analysis of electrically conductive silver ink on stretchable substrates under tensile load
-
S. Merilampi, T. Bjorninen, V. Haukka, P. Ruuskanen, L. Ukkonen, and L. Sydanheimo Analysis of electrically conductive silver ink on stretchable substrates under tensile load Microelectron Reliab 50 12 2010 2001 2011
-
(2010)
Microelectron Reliab
, vol.50
, Issue.12
, pp. 2001-2011
-
-
Merilampi, S.1
Bjorninen, T.2
Haukka, V.3
Ruuskanen, P.4
Ukkonen, L.5
Sydanheimo, L.6
-
3
-
-
84866486776
-
Highly conductive and stretchable silver nanowire conductors
-
F. Xu, and Y. Zhu Highly conductive and stretchable silver nanowire conductors Adv Mater 24 37 2012 5117 5122
-
(2012)
Adv Mater
, vol.24
, Issue.37
, pp. 5117-5122
-
-
Xu, F.1
Zhu, Y.2
-
4
-
-
51349129800
-
Mesh interconnects for silicone embedded stretchable silicon electronics
-
Sosin S, Zoumpoulidis T, Bartek M, Wang L, Dekker R, Jansen K.M.B, Ernst L.J. Mesh interconnects for silicone embedded stretchable silicon electronics. In: 58th Electronic components & technology conference, proceedings, 2008. p. 1339-45.
-
(2008)
58th Electronic Components & Technology Conference, Proceedings
, pp. 1339-1345
-
-
Sosin, S.1
Zoumpoulidis, T.2
Bartek, M.3
Wang, L.4
Dekker, R.5
Jansen, K.M.B.6
Ernst, L.J.7
-
5
-
-
23744443567
-
Stretchable interconnects for elastic electronic surfaces
-
S.P. Lacour, J. Jones, S. Wagner, T. Li, and ZG. Suo Stretchable interconnects for elastic electronic surfaces Proc IEEE 93 8 2005 1459 1467
-
(2005)
Proc IEEE
, vol.93
, Issue.8
, pp. 1459-1467
-
-
Lacour, S.P.1
Jones, J.2
Wagner, S.3
Li, T.4
Suo, Z.G.5
-
6
-
-
84903870943
-
Stretchable interconnections for flexible electronic systems
-
Lin JH, Yan B, Wu XM, Ren TL, Liu LT, Stretchable interconnections for flexible electronic systems, EMBC: 2009 Annual international conference of the IEEE engineering in medicine and biology society, vols. 1-20; 2009. p. 4124-27.
-
(2009)
EMBC: 2009 Annual International Conference of the IEEE Engineering in Medicine and Biology Society
, vol.1-20
, pp. 4124-4127
-
-
Lin, J.H.1
Yan, B.2
Wu, X.M.3
Ren, T.L.4
Liu, L.T.5
-
7
-
-
73849112041
-
Optimized structural designs for stretchable silicon integrated circuits
-
D.H. Kim, Z. Liu, Yun-Soung Kim, Jian Wu, and Jizhou Song Optimized structural designs for stretchable silicon integrated circuits Small 5 24 2009 2841 2847
-
(2009)
Small
, vol.5
, Issue.24
, pp. 2841-2847
-
-
Kim, D.H.1
Liu, Z.2
Kim, Y.-S.3
Wu, J.4
Song, J.5
-
8
-
-
34447274277
-
Design and fabrication of elastic interconnections for stretchable electronic circuits
-
D. Brosteaux, F. Axisa, M. Gonzalez, and J. Vanfleteren Design and fabrication of elastic interconnections for stretchable electronic circuits IEEE Electron Dev. Lett 28 7 2007 552 554
-
(2007)
IEEE Electron Dev. Lett
, vol.28
, Issue.7
, pp. 552-554
-
-
Brosteaux, D.1
Axisa, F.2
Gonzalez, M.3
Vanfleteren, J.4
-
9
-
-
84858785345
-
Printed circuit board inspired fabrication technologies for stretchable electronics
-
J. Vanfleteren, M. Gonzalez, F. Bossuyt, Y.-Y. Hsu, T. Vervust, and I. De Wolf Printed circuit board inspired fabrication technologies for stretchable electronics MRS Bull 37 3 2012 254 260
-
(2012)
MRS Bull
, vol.37
, Issue.3
, pp. 254-260
-
-
Vanfleteren, J.1
Gonzalez, M.2
Bossuyt, F.3
Hsu, Y.-Y.4
Vervust, T.5
De Wolf, I.6
-
10
-
-
84878472599
-
-
FP7, 14th August
-
FP7, PLACE-it project website , 14th August 2012.
-
(2012)
-
-
-
11
-
-
77955509627
-
Design and fabrication of large-area redundant, stretchable interconnect meshes using excimer laser photoablation and in situ masking
-
K.L. Lin, J. Chae, and K. Jain Design and fabrication of large-area redundant, stretchable interconnect meshes using excimer laser photoablation and in situ masking IEEE Trans Adv Packag 33 3 2010 592 601
-
(2010)
IEEE Trans Adv Packag
, vol.33
, Issue.3
, pp. 592-601
-
-
Lin, K.L.1
Chae, J.2
Jain, K.3
-
12
-
-
78751645105
-
The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects
-
Y.-Y. Hsu, M. Gonzalez, F. Bossuyt, F. Axisa, J. Vanfleteren, and I. De Wolf The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects Thin Solid Films 219 2011 2225 2234
-
(2011)
Thin Solid Films
, vol.219
, pp. 2225-2234
-
-
Hsu, Y.-Y.1
Gonzalez, M.2
Bossuyt, F.3
Axisa, F.4
Vanfleteren, J.5
De Wolf, I.6
-
13
-
-
79951950797
-
Cyclic endurance reliability of stretchable electronic substrates
-
F. Bossuyt, J. Guenther, T. Löher, M. Seckel, T. Sterken, and J. de Vries Cyclic endurance reliability of stretchable electronic substrates Microelectron Reliab 51 2011 628 635
-
(2011)
Microelectron Reliab
, vol.51
, pp. 628-635
-
-
Bossuyt, F.1
Guenther, J.2
Löher, T.3
Seckel, M.4
Sterken, T.5
De Vries, J.6
-
15
-
-
79955907514
-
Design and implementation of flexible and stretchable systems
-
M. Gonzalez, B. Vandevelde, W. Christiaens, Hsu Yung-Yu, F. Iker, and F. Bossuyt Design and implementation of flexible and stretchable systems Microelectron Reliab 51 6 2011 1069 1076
-
(2011)
Microelectron Reliab
, vol.51
, Issue.6
, pp. 1069-1076
-
-
Gonzalez, M.1
Vandevelde, B.2
Christiaens, W.3
Yung-Yu, H.4
Iker, F.5
Bossuyt, F.6
-
16
-
-
77953890820
-
The effect of pitch on deformation behavior and the stretching-induced failure of a polymer - Encapsulated stretchable circuit
-
Y.-Y. Hsu, M. Gonzalez, F. Bossuyt, F. Axisa, J. Vanfleteren, and I. De Wolf The effect of pitch on deformation behavior and the stretching-induced failure of a polymer - encapsulated stretchable circuit J Micromech Microeng 20 7 2010
-
(2010)
J Micromech Microeng
, vol.20
, Issue.7
-
-
Hsu, Y.-Y.1
Gonzalez, M.2
Bossuyt, F.3
Axisa, F.4
Vanfleteren, J.5
De Wolf, I.6
-
17
-
-
77956945316
-
A comparison of maximum likelihood and median rank regression for Weibull analysis
-
U. Genschel, and W. Meeker A comparison of maximum likelihood and median rank regression for Weibull analysis Qual Eng 22 4 2010 234 253
-
(2010)
Qual Eng
, vol.22
, Issue.4
, pp. 234-253
-
-
Genschel, U.1
Meeker, W.2
-
18
-
-
79960841549
-
Polyimide - Enhanced stretchable interconnects: Design, fabrication, and characterization
-
Y.-Y. Hsu, M. Gonzalez, F. Bossuyt, J. Vanfleteren, and I. De Wolf Polyimide - enhanced stretchable interconnects: design, fabrication, and characterization IEEE Trans Electron Dev 58 8 2011 2680 2688
-
(2011)
IEEE Trans Electron Dev
, vol.58
, Issue.8
, pp. 2680-2688
-
-
Hsu, Y.-Y.1
Gonzalez, M.2
Bossuyt, F.3
Vanfleteren, J.4
De Wolf, I.5
-
19
-
-
7544230505
-
Delocalizing strain in a thin metal film on a polymer substrate
-
T. Li, Z.Y. Huang, Z.C. Xi, S. Lacour, S. Wagner, and Z. Suo Delocalizing strain in a thin metal film on a polymer substrate Mech Mater 37 2005 261 273
-
(2005)
Mech Mater
, vol.37
, pp. 261-273
-
-
Li, T.1
Huang, Z.Y.2
Xi, Z.C.3
Lacour, S.4
Wagner, S.5
Suo, Z.6
-
20
-
-
84866327157
-
Integration of stretchable and washable electronic modules for smart textile applications
-
T. Vervust, G. Buyle, F. Bossuyt, and J. Vanfleteren Integration of stretchable and washable electronic modules for smart textile applications J Textile Inst 103 10 2012 1127 1138
-
(2012)
J Textile Inst
, vol.103
, Issue.10
, pp. 1127-1138
-
-
Vervust, T.1
Buyle, G.2
Bossuyt, F.3
Vanfleteren, J.4
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