Stretchable interconnections for flexible electronic systems

Proceedings of the 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society: Engineering the Future of Biomedicine, EMBC 2009

Volumn , Issue , 2009, Pages 4124-4127

  Lin, Jianhui ^a   Yan, Bing ^a   Wu, Xiaoming ^a   Ren, Tianling ^a   Liu, Litian ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION EXAMPLES; APPLIED STRAIN; CURVATURE RADII; EFFICIENCY AND RELIABILITY; ELASTIC SUBSTRATE; ELECTRICAL INTERCONNECTIONS; FLEXIBLE ELECTRONIC SYSTEMS; MEDICAL SYSTEMS; METAL INTERCONNECTIONS; PRE-STRAIN; SMART CLOTHES; TRANSFER PRINTING; WAVY GEOMETRY;

BIOLOGY; ELECTRONICS ENGINEERING; GOLD; SEMICONDUCTING SILICON COMPOUNDS; SUBSTRATES;

SILICON WAFERS;

GOLD; METAL; SILICON;

ARTICLE; BIOMEDICAL ENGINEERING; CHEMISTRY; ELECTRIC CONDUCTIVITY; ELECTRONICS; EQUIPMENT; EQUIPMENT DESIGN; HUMAN; MATERIALS TESTING; METHODOLOGY; PRESSURE; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY;

BIOMEDICAL ENGINEERING; ELECTRIC CONDUCTIVITY; ELECTRONICS; ELECTRONICS, MEDICAL; EQUIPMENT DESIGN; GOLD; HUMANS; MATERIALS TESTING; METALS; MICROSCOPY, ELECTRON, SCANNING; PRESSURE; SILICON; SURFACE PROPERTIES;

EID: 84903870943     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMBS.2009.5332697     Document Type: Conference Paper

References (7)

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