Free-standing, parylene-sealed copper interconnect for stretchable silicon electronics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1339-1345

  Sosin, S ^a   Zoumpoulidis, T ^a   Bartek, M ^a   Wang, L ^a   Dekker, R ^a,b   Jansen, K M B ^a   Ernst, L J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; ELECTRIC FIELD EFFECTS; RIGIDITY; SILICON; TENSILE TESTING;

ELECTRONIC COMPONENTS; PARYLENE;

COPPER;

EID: 51349129800     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550149     Document Type: Conference Paper

References (4)

1. Lacour S.P, Jones J., Suo Z., Wagner S., "Design and Performance of Thin Metal Film Interconnects for SkinLike Electronic Circuits," IEEE Electron Device Letters, Vol. 25, No. 4 (2004), pp. 179-181.
2. th Electronics Packaging Technology Conf, Singapore, Dec. 2006, pp. 271-276.
3. Read D.T. and Dally J.W., Mechanics and Materials for Electronic Packaging: Volume 2, Thermal and Mechanical Behavior and Modeling, American Society of Mechanical Engineers, AMD-VoI, 1994, p.41-49.
4. Brosteaux D., Axisa F., Gonzalez M., Vanfleteren J., "Design and Fabrication of Elastic Interconnections for Stretchable Electronic Circuits," IEEE Electron Device Letters, Vol 28, No. 7 (2007), pp. 552-554.