Flexible capacitive sensor encapsulating liquids as dielectric with a largely deformable polymer membrane

Micro and Nano Letters

Volumn 7, Issue 12, 2012, Pages 1193-1196

  Ahmad Ridzuan, N A ^a   Masuda, S ^a   Miki, N ^a,b  

^a KEIO UNIVERSITY   (Japan)

^b JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFICATION RATIO; CURVED SURFACES; EXTERNAL PRESSURES; POLYMER MEMBRANE; SENSING AREAS; SENSOR SENSITIVITY;

CAPACITIVE SENSORS; FUNCTIONAL POLYMERS; RESERVOIRS (WATER); SENSORS;

DIELECTRIC LIQUIDS;

POLYMER;

ARTICLE; DIELECTRIC CONSTANT; ELECTRODE; ENCAPSULATION; FLEXIBLE CAPACITIVE SENSOR; SENSOR;

EID: 84878348668     PISSN: None     EISSN: 17500443     Source Type: Journal    
DOI: 10.1049/mnl.2012.0560     Document Type: Article

References (34)

1. - 10.1109/JMEMS.2006.886021 Lee H.K. Chang S.I. Yoon E. A flexible polymer tactile sensor: fabrication and modular expandability for large area deployment J. Microelectromech. Syst. 1057-7157 2006 15 6 1681-1686
2. Cheng M.Y. Huang X.H. Ma C.W. Yang Y.J. A flexible capacitive tactile sensor array with floating electrodes J. Micromech. Microeng. 0960-1317 2009 19 11 1681-1686
3. - 10.1016/S0957-4158(03)00048-5 Eltaib M.E.H. Hewit J.R. Tactile sensing technology for minimal access surgery - a review Mechatronics 0957-4158 2003 13 10 1163-1177
4. - 10.1016/0924-4247(92)80089-L Zhu F. Spronck J.W. A capacitive tactile sensor for shear and normal force measurements Sens. Actuators A, Phys. 0924-4247 1992 31 115-120
5. Hoshi T. Shinoda H. Robot skin based on touch-area-sensitive tactile element Proc. IEEE Int. Conf. Robotics and Automation 2006 Orlando FL USA 3463-3468
6. - 10.1109/JMEMS.2008.921727 Lee H.K. Chung J. Chang S.I. Yoon E. Normal and shear force measurement using a flexible polymer tactile sensor with embedded multiple capacitors J. Microelectromech. Syst. 1057-7157 2008 17 934-942
7. Ko C.T. Wu J.P. Wang W.C. A highly sensitive CMOS-MEMS capacitive tactile sensor Proc. IEEE 19th Int. Conf. MEMS 2006 Istanbul Turkey 642-645
8. - 10.1016/S0924-4247(98)00155-1 Wibbeler J. Pfeifer G. Hietschold M. Parasitic charging of dielectric surfaces in capacitive microelectromechanical systems (MEMS) Sens. Actuators A, Phys. 0924-4247 1998 71 74-80
9. Fujimori T. Hanaoka Y. Fukuda H. Above-IC integration of capacitive pressure sensor fabricated with CMOS interconnect processes Proc. IEEE 20th Int. Conf. MEMS 2007 Hyogo Japan 43-46
10. Salo T. Kirstein K.U. Sedivy J. Continuous blood pressure monitoring utilizing a CMOS tactile sensor Proc. 26th Int. Conf. IEEE Engineering in Medicine and Biology Society 2004 San Francisco CA USA 2326-2329
11. Hezarjaribi Y. Hamidon M.N. Keshmiri S.H. Bahadorimehr A.R. Capacitive pressure sensors based on MEMS, operating in harsh environments Proc. IEEE Int. Conf. Semiconductor Electronics 2008 Johor Bahru Malaysia 184-187
12. Wang S. Feng Y. Microcapacitive vacuum sensor based on MEMS Proc. 5th IEEE Int. Conf. Nano/Microengineered and Molecular Systems (NEMS), Xiamen China 1160-1164
13. Huan X.D. Huan J.Q. Qin M. Huan Q.A. A fully integrated capacitive pressure sensor with high sensitivity Proc. IEEE Sensors Conf. 2007 Atlanta GA USA 1052-1055
14. - 10.1109/TMECH.2003.816805 Shkel Y.M. Ferrier N.J. Electrostriction enhancement of solid-state capacitance sensing Mechatronics 0957-4158 2003 8 318-325
15. Thakur O.P. Singh A.K. Modeling of capacitive sensor filled with elastic dielectrics and its advantages Proc. 3rd Int. Conf. Sensing Technology 2008 Tainan Taiwan 467-471
16. Lacour S.P. Cotton D.P.J. Elastomeric capacitive sensors Proc. 16th Int. Conf. Solid-State Sensors, Actuators and Microsystems (Transducers'11) 2011 Beijing China 2770-2773
17. - 10.1109/JMEMS.2009.2034391 Peng P. Rajamani R. Erdman A.G. Flexible tactile sensor for tissue elasticity measurements J. Microelectromech. Syst. 1057-7157 2009 18 1226-1233
18. Kim H.K. Lee S.G. Han J.E. Transparent and flexible tactile sensor for multi touch screen application with force sensing Proc. Int. Conf. Solid-State Sensors, Actuators and Microsystems (Transducers 2009) Denver CO USA 1146-1149
19. Cheng M.Y. Tsao C.M. Lai Y.T. Yang Y.J. A novel highly-twistable tactile sensing array using extendable spiral electrodes Proc. IEEE 21st Int. Conf. MEMS 2009 Sorrento Italy 92-95
20. - 10.1016/j.sna.2005.09.023 Noda K. Hoshino K. Matsumoto K. Shimoyama I. A shear stress sensor for tactile sensing with the piezoresistive cantilever standing in elastic material Sens. Actuators A, Phys. 0924-4247 2006 127 295-301
21. - 10.1109/JSEN.2004.833152 Shimojo M. Namiki A. Ishikawa M. Makino R. Mabuchi K. A tactile sensor sheet using pressure conductive rubber with electrical-wires stitched method IEEE Sens. J. 1530-437X 2004 4 589-596
22. Kerpa O. Weiss K. Worn H. Development of a flexible tactile sensor system for a humanoid robot Proc. IEEE/RSJ Int. Conf. Intelligent Robots and Systems 2003 Nice France 1-6
23. - 10.1088/0960-1317/13/3/302 Engel J. Chen J. Liu C. Development of polyimide flexible tactile sensor skin J. Micromech. Microeng. 0960-1317 2003 13 359-366
24. - 10.1063/1.2978330 Nguyen B.K. Matsumoto K. Shimoyama I. Polymer thin film deposited on liquid for varifocal encapsulated liquid lenses Appl. Phys. Lett. 0003-6951 2008 93 12 124101
25. Kim H. Najafi K. An electrically-driven, large-deflection, high-force, micropiston hydraulic actuator array for large-scale microfluidic systems Proc. IEEE 21st Int. Conf. MEMS 2009 Sorrento Italy 483-486
26. Yeh J.A. Yang C.C. Chan C.T. Optofluidic micro/nanosystems Proc. Int. Workshop on Micro/Nano-Engineering 2011 Kyoto Japan 3-4
27. Matsumoto S. Ichikawa N. New methods for liquid encapsulation in polymer MEMS structures Proc. 21st IEEE Int. Conf. MEMS 2008 2008 Tucson AZ USA 415-418
28. - 10.3390/s100402946 Arouette X. Matsumoto Y. Ninomiya T. Okayama Y. Miki N. Dynamic characteristics of a hydraulic amplification mechanism for large displacement actuators systems Sensors 0746-9462 2010 10 2946-2956
29. - 10.1016/j.sna.2009.07.002 Ninomiya T. Okayama Y. Matsumoto Y. Arouette X. Osawa K. Miki N. MEMS-based hydraulic displacement amplification mechanism with completely encapsulated liquid Sens. Actuators A, Phys. 0924-4247 2009 166 2 277-282
30. - 10.1088/0960-1317/20/9/095018 Okayama Y. Nakahara K. Arouette X. Characterization of a bonding-in-liquid technique for liquid encapsulation into MEMS devices J. Micromech. Microeng. 0960-1317 2010 20 9 095018
31. Antelius M. Fischer A.C. Niklaus F. Stemme G. Roxhed N. Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level Proc. IEEE 24th Int. Conf. MEMS 2011 Cancun Mexico 356-359
32. - 10.3390/mi3010137 Hotta Y. Zhang Y. Miki N. A flexible capacitive sensor with encapsulated liquids as dielectrics Micromachines 2012 3 1 137-149
33. 'Glycerine: an overview' (The Soap and Detergent Association, Glycerine & Oleochemical Division, New York, 1990)
34. - 10.1002/tee.20429 Zhang Y. Ishida M. Kazoe Y. Sato Y. Miki N. Water-vapor permeability control of PDMS by the dispersion of collagen powder IEE J. Trans. Electr. Electron. Eng. 2009 4 3 442-449