Advances in fluid and thermal transport property analysis and design of sintered porous wick microstructures

Journal of Heat Transfer

Volumn 135, Issue 6, 2013, Pages

  Bodla, Karthik K ^a   Weibel, Justin A ^a   Garimella, Suresh V ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Direct simulation; Electronics cooling; Microtomography; Porous media; Reverse engineering; Sintered materials; Thermal and fluid transport

Indexed keywords

DIRECT SIMULATION; ELECTRONICS COOLING; FLUID TRANSPORT; MICRO-TOMOGRAPHY; SINTERED MATERIALS;

CHARACTERIZATION; DESIGN; ELECTRONIC COOLING; GEOMETRY; HEAT TRANSFER; MICROSTRUCTURE; MODELS; PACKED BEDS; POROSITY; POROUS MATERIALS; REVERSE ENGINEERING; SINTERING;

TRANSPORT PROPERTIES;

EID: 84878320875     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.4023569     Document Type: Article

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