Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation

Journal of Micromechanics and Microengineering

Volumn 23, Issue 2, 2013, Pages

  Molina Lopez, F ^a   Quintero, A Vásquez ^a   Mattana, G ^a   Briand, D ^a   De Rooij, N F ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVE METHODS; COST-EFFICIENT; ENCAPSULATION LAYER; FLEXIBLE SUBSTRATE; INTERDIGITATED CAPACITORS; SENSING LAYERS; THERMAL COMPENSATION; THERMO-RESISTORS;

ELECTRODEPOSITION; PRINTING; SENSOR ARRAYS;

FABRICATION;

EID: 84878162713     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/2/025012     Document Type: Article

References (24)

1. Das R and Harrop P 2012 Printed, organic & flexible electronics forecasts, players & opportunities 2012-2022 IDTechEx
2. Cherenack K, Zysset C, Kinkeldei T, Münzenrieder N and Tröster G 2010 Woven electronic fibers with sensing and display functions for smart textiles Adv. Mater. 22 5178-82
3. Kinkeldei T, Zysset C, Cherenack K and Troester G 2009 Development and evaluation of temperature sensors for textile integration IEEE Sens. Conf. 1-3 1502-05
4. Unander T and Nilsson H E 2009 Characterization of printed moisture sensors in packaging surveillance applications IEEE Sens. J. 9 922-28
5. Li Y, Rongwei Z, Staiculescu D, Wong C P and Tentzeris M M 2009 A novel conformal RFID-enabled module utilizing inkjet-printed antennas and carbon nanotubes for gas-detection applications IEEE Antennas Wirel. Propag. Lett. 8 653-56
6. Virtanen J, Ukkonen L, Bjorninen T and Sydanheimo L 2010 Sensors Applications Symp. (SAS), 2010 IEEE Printed humidity sensor for UHF RFID systems
7. Potyrailo R A, Burns A, Surman C, Lee D J and McGinniss E 2012 Multivariable passive RFID vapor sensors: roll-to-roll fabrication on a flexible substrate Analyst 137 2777-81
8. Kim D-H et al 2010 Dissolvable films of silk fibroin for ultrathin conformal bio-integrated electronics Nature Mater. 9 511-7
9. Molina-Lopez F, Briand D and de Rooij N F 2012 All additive inkjet printed humidity sensors on plastic substrate Sensors Actuators Chem. B 166-167 212-22
10. Weremczuk J, Tarapata G and Jachowicz R S 2012 The ink-jet printing humidity sorption sensor - modelling, design, technology and characterization Meas. Sci. Technol. 23 014003
11. Starke E, Turke A, Krause M and Fischer W J 2011 Solid-State Sens, Actuators and Microsyst. Conf. (TRANSDUCERS), 2011 16th Int. Flexible polymer humidity sensor fabricated by inkjet printing
12. Altenberend U, Molina-Lopez F, Briand D, Oprea A, Bårsan N, Weimar U and de Rooij N F 2012 IMCS 2012 - The 14th Int. Meet. on Chem. Sens. Inkjet printed capacitive transducers on flexible plastic substrates with increase stability (Nürnberg, Germany, 20-23 May)
13. Courbat J, Briand D and de Rooij N F 2010 Foil level packaging of a chemical gas sensor J. Micromech. Microeng. 20 055026
14. de Gans B J, Duineveld P C and Schubert U S 2004 Inkjet printing of polymers: state of the art and future developments Adv. Mater. 16 203-13
15. Houston W V 1952 The temperature dependence of electrical resistance Phys. Rev. 88 1321-23
16. Moser Y and Gijs M A M 2007 Miniaturized flexible temperature sensor J. Microelectromech. Syst. 16 1349-54 (Pubitemid 350239127)
17. Lee C-Y, Wu G-W and Hsieh W-J 2008 Fabrication of micro sensors on a flexible substrate Sensors Actuators Phys. A 147 173-6
18. Felba J, Nitsch K, Piasecki T, Paluch P, Moscicki A and Kinart A 2009 The influence of thermal process on electrical conductivity of microstructures made by ink-jet painting with the use of ink containing nano sized silver particles Proc. of the 9th IEEE Conf. on Nanotechnology pp 408-11
19. Igreja R and Dias C J 2004 Analytical evaluation of the interdigital electrodes capacitance for a multi-layered structure Sensors Actuators Phys. A 112 291-301
20. Lok B K, Liang Y N, Gian P W, Shan X and Lu A C W 2007 Electronics Packaging Technology Conf., 2007 (EPTC 2007) 9th Process integration of inkjet printing and electroless plating for LTCC substrates (10-12 December 2007)
21. Liu H-C, Chuang C-P, Chen Y-T and Du C-H 2009 Inkjet printing for silicon solar cells Water, Air, & Soil Pollution Focus 9 495-8
22. Cauchois R, Saadaoui M, Legeleux J, Malia T, Dubois-Bonvalot B, Inal K and Fidalgo J C 2010 Electronic System-Integration Technology Conf. (ESTC), 2010 3rd Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages (13-16 September 2010)
23. Meier R C, Badilita V, Brunne J, Wallrabe U and Korvink J G 2011 Complex three-dimensional high aspect ratio microfluidic network manufactured in combined PerMX dry-resist and SU-8 technology Biomicrofluidics 5 034111
24. Molina-Lopez F, Vásquez Quintero A, Mattana G, Briand D and De Rooij N F 2012 IMCS 2012 - The 14th Int. Meeting on Chemical Sensors All-additive inkjet printed humidity and temperature sensors fabricated and encapsulated at foil level (Nürnberg, Germany, 20-23 May)