Properties of two new medium temperature solders

Soldering & Surface Mount Technology

Volumn 21, Issue 2, 2009, Pages 4-8

  Chunyuan, C ^a   Wang, Xitao ^a   Yuan, Wenxia ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Alloys; High temperatures; Solders

Indexed keywords

DESIGN/METHODOLOGY/APPROACH; EUTECTIC POINTS; HIGH TEMPERATURES; LIQUIDUS; MATRIX COMPOSITE; MEDIUM TEMPERATURE; MELTING TEMPERATURES; SOLDER ALLOYS; SOLDER MATERIAL; SOLDERS; TEMPERATURE RANGE; THERMAL PROPERTIES; WETTABILITY TESTS;

ALLOYS; CHIP SCALE PACKAGES; COPPER ALLOYS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; EUTECTICS; GERMANIUM; MELTING POINT; MICROSTRUCTURE; PACKAGING MATERIALS; SILVER; SOLDERING ALLOYS; STEELMAKING; SUBSTRATES; THERMODYNAMIC PROPERTIES;

SILVER ALLOYS;

EID: 70349212423     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910910947408     Document Type: Article

References (10)

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