Fluxless tin bonding of silicon chips to aluminum substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 1136-1139

  Hsu, Shou Jen ^a   Sha, Chu Hsuan ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AL PAIRS; AL SUBSTRATE; ALUMINUM SUBSTRATE; AUTOMOTIVE DESIGNS; BONDED STRUCTURE; BONDING PRESSURE; BONDING PROCESS; CU LAYERS; ELECTRONIC PACKAGING; ENERGY DISPERSIVE X RAY SPECTROSCOPY; FLUXLESS; HIGH THERMAL CONDUCTIVITY; HIGH-POWER DEVICES; LIGHT WEIGHT; SI CHIPS; SILICON CHIP; SOLDER LAYERS;

ALUMINUM; ELECTROPLATING; SCANNING ELECTRON MICROSCOPY; SILICON; SUBSTRATES; THERMAL CONDUCTIVITY; TIN; X RAY SPECTROSCOPY;

CHIP SCALE PACKAGES;

EID: 84866866021     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248978     Document Type: Conference Paper

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