|
|
|
Volumn 29, Issue 7, 2007, Pages 17-20
|
|
Laser-based dicing: Doing thin better
a
a
XSiL
*
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
COMPETITIVE INTELLIGENCE;
PRODUCT DEVELOPMENT;
STRENGTH OF MATERIALS;
SUSTAINABLE DEVELOPMENT;
WAFER BONDING;
COST-OF-OWNERSHIP (COO);
LASER-BASED DICING TECHNOLOGIES;
STRENGTH ENHANCEMENT;
ULTRA-THIN WAFERS;
WAFER DICING;
LASER THEORY;
|
|
EID: 34547415481
PISSN: 17511135
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
|
Times cited : (2)
|
|
References (0)
|
