Double-pulse format for improved laser drilling

Photonics Spectra

Volumn 41, Issue 9, 2007, Pages

  Forsman, Andrew C ^a   Lundgren, Erik H ^a   Dodell, Aaron L ^a   Komashko, Aleksey M ^a   Armas, Michael S ^a  

^a GENERAL ATOMICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LASER DRILLING; NANOSECOND LASER PULSE;

DRILLING; HEAT AFFECTED ZONE; LASER APPLICATIONS;

LASER PULSES;

EID: 34948866235     PISSN: 07311230     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

1. H. Rhode (2001). LIA Handbook of Laser Materials Processing, J.F. Ready, ed. Laser Institute of America, pp. 474-477.
2. E.H. Lundgren et al (May 2007). Fabrication of pressurized 2 mm beryllium targets for ICF experiments. FUSION SCI TECH, pp. 576-580.
3. A.C. Forsman et al (Aug. 1, 2005). Double-pulse machining as a technique for the enhancement of material removal rates in laser machining of metals. J APPL PHYS, 033302.
4. A.C. Forsman and G.A. Kyrala (May 2001). Non-Doppler shift related experimental shock wave measurements using velocity interferometer systems for any reflector. PHYS REV E, Vol. 63, 056402.
5. D. Bäuerle (2000). Laser processing and chemistry, Springer Berlin, p. 244.
6. C. Lehane and H.S. Kwok (July 2001). Enhanced drilling using a dual-pulse Nd:YAG laser. APPL PHYS A: MATER SCI PROCESS, pp. 45-58.