Effect of temperatures on electrodeposition of CoWP films

Surface Engineering

Volumn 29, Issue 3, 2013, Pages 200-204

  Yu, Y D ^a   He, M M ^a   Li, M G ^a   Guo, H F ^a   Wei, G Y ^a   Ge, H L ^a  

^a CHINA JILIANG UNIVERSITY   (China)

Author keywords

Coercivity; CoWP; Electrodeposition

Indexed keywords

COBALT COMPOUNDS; COERCIVE FORCE; ELECTRODEPOSITION; METALLIC FILMS; SATURATION MAGNETIZATION;

CODEPOSITION MECHANISMS; COPPER SUBSTRATES; COWP; CRYSTALLOGRAPHIC ORIENTATIONS; DEPOSITED FILMS; EFFECT OF TEMPERATURE; ELECTRODEPOSITION PROCESS; TETRAHEDRAL STRUCTURES;

COBALT;

EID: 84877101908     PISSN: 02670844     EISSN: 17432944     Source Type: Journal    
DOI: 10.1179/1743294413Y.0000000121     Document Type: Article

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