Study on preparation of Co-Pt-W alloy films by electrodeposition

Materials Science and Technology

Volumn 28, Issue 4, 2012, Pages 448-453

  Yu, Y D ^a   Lou, J W ^a   Li, W ^a   Sun, L X ^a   Ge, H L ^a   Wei, G Y ^a  

^a CHINA JILIANG UNIVERSITY   (China)

Author keywords

Co Pt W thin films; Coercivity; Electroplating; Saturation magnetisation

Indexed keywords

AGGLOMERATED PARTICLES; ALLOY FILM; COPPER SUBSTRATES; DEPOSITED FILMS; HCP STRUCTURE; HIGH COERCIVITY; PH VALUE;

COBALT; COERCIVE FORCE; CURRENT DENSITY; ELECTROPLATING; METALLIC FILMS; PH EFFECTS; PLATINUM; SATURATION MAGNETIZATION; TUNGSTEN; TUNGSTEN ALLOYS; TUNGSTEN COMPOUNDS;

FILM PREPARATION;

EID: 84860427675     PISSN: 02670836     EISSN: 17432847     Source Type: Journal    
DOI: 10.1179/1743284711Y.0000000065     Document Type: Article

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