Comparison of high resolution patterning technologies for LTCC microwave circuits

International Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007

Volumn , Issue , 2007, Pages 98-103

  Muller J ^a   Perrone, R ^a   Drue K H ^a   Stephan, R ^a   Trabert, J ^a   Hein, M ^a   Schwanke, D ^b   Pohlner, J ^b   Reppe, G ^c   Kulke, R ^d   Uhlig, P ^d   Jacob, A F ^e   Baras, T ^e   Molke, A ^e  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^b MSE Micro Systems Engineering GmbH & Co   (Germany)

^c RHe Microsystems GmbH   (Germany)

^d IMST GMBH   (Germany)

^e HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

LTCC; Microwave; Satellite application; Thin film

Indexed keywords

CONSORTIUM MEMBERS; HIGH-RESOLUTION PATTERNING; LOW-TEMPERATURE CO-FIRED CERAMICS; LTCC; MULTIMEDIA SATELLITES; PATTERNING TECHNOLOGY; PHYSICAL MEASUREMENT; SATELLITE APPLICATIONS;

CERAMIC MATERIALS; CHIP SCALE PACKAGES; CIRCUIT OSCILLATIONS; ETCHING; FREQUENCY BANDS; MICROELECTRONICS; MICROSYSTEMS; MICROWAVE CIRCUITS; MICROWAVES; SATELLITE COMMUNICATION SYSTEMS; SUBSTRATES; THICK FILMS; THIN FILMS;

TECHNOLOGY;

EID: 84876947469     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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