Development and evaluation of hermetic ceramic microwave packages for space applications

Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Volumn , Issue , 2005, Pages 32-37

  Müller, Jens ^a   Pohlner, Jürgen ^a   Schwanke, Dieter ^a   Reppe, Günter ^b   Thust, Heiko ^c   Perrone, Ruben ^c  

^a MSE Micro Systems Engineering GmbH & Co   (Germany)

^b RHe Microsystems GmbH   (Germany)

^c ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Fine line thick film; Lead free; LTCC; Microwave packages; Thermal design; Thin film

Indexed keywords

HAZARDOUS SUBSTANCES; LEAD-FREE; LTCC; MINISTRY OF EDUCATION; RESEARCH INSTITUTES; SATELLITE APPLICATIONS; THERMAL DESIGNS; THIN-FILM PROCESSING;

ELECTRONICS PACKAGING; EXHIBITIONS; FILM PREPARATION; HEAT SINKS; MICROSYSTEMS; MICROWAVES; SPACE APPLICATIONS; TECHNOLOGY; THICK FILMS; THIN FILMS;

CERAMIC MATERIALS;

EID: 84877790853     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. th International Symposium 011 Microelectronics, Nov. 14-18, 2004. Long Beach. CA.
2. Dan Amey. Mimi Keating: Themial Perfomiance of 943 Low Loss Green Tape LTCC with Themial Via and Internal Metallization Enhancements, Proceedings of the 2004 Ceramic Interconnect Technology Conference. April 26-28, 2004. Denver/CO, USA.
3. th International Symposium on Microelectronics, Nov. 14-18, 2004. Long Beach. CA.
4. th European Microelectronics and Packaging Conference, June 12-15. 2005. Brugge/Belgium.
5. th European Microelectronics and Packaging Conference. June 12-15. 2005. Brugge/Belgium.