Packaged microwave components for multimedia satellite communication

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 241-245

  Kulke, Reinhard ^a   Gunner, Carsten ^a   Kersten, Olaf ^a   Winkler, Josef ^a   Rittweger, Matthias ^a  

^a IMST GMBH   (Germany)

Author keywords

LTCC; Microwave; Satellite communication; Wireless

Indexed keywords

LTCC; LTCC (LOW TEMPERATURE CO-FIRED CERAMIC); MICROWAVE COMPONENTS; MULTILAYER STRUCTURES; MULTIMEDIA SATELLITES; SATELLITE COMMUNICATIONS; SEMICONDUCTOR COMPONENTS; SOLID STATE POWER AMPLIFIER;

CIRCUIT OSCILLATIONS; COBALT COMPOUNDS; MICROELECTRONICS; MICROWAVES; MULTILAYERS; POWER AMPLIFIERS; RADIO; SATELLITE COMMUNICATION SYSTEMS;

CHIP SCALE PACKAGES;

EID: 35348946811     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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3. R. Kulke, W. Simon, M. Rittweger, I. Wolff, S. Baker, R. Powell, M. Harrison: "Integration Techniques for MMICs and Chip Devices in LTCC Mul- tichip Modules for Radio Frequencies", IMAPS, Boston, September 2000.
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