Technology benchmarking of high resolution structures on LTCC for microwave circuits

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 111-117

  Muller J ^a,f   Perrone, R ^a   Thust, H ^a   Drue K H ^a   Kutscher, C ^a   Stephan, R ^a   Trabert, J ^a   Hein, M ^a   Schwanke, D ^b   Pohlner, J ^b   Reppe, G ^c   Kulke, R ^d   Uhlig, P ^d   Jacob, A F ^e   Baras, T ^e   Molke, A ^e  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^b MSE GmbH and Co

^c RHe Microsystems GmbH   (Germany)

^d IMST GMBH   (Germany)

^e HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^f IMST GmbH ^*  (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BENCHMARKING; LINEWIDTH; MULTIMEDIA SYSTEMS; OPTICAL FILTERS; SATELLITE COMMUNICATION SYSTEMS; SUBSTRATES;

EDGE-COUPLED FILTERS; LOW TEMPERATURE CO-FIRED CERAMICS (LTCC); MULTIMEDIA SATELLITE COMMUNICATIONS;

MICROWAVE CIRCUITS;

EID: 42549141619     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.279987     Document Type: Conference Paper

References (4)

1. MESSE-NEWS-KOENEN; Ausgabe Frühjahr 2006, SMT/Hybrid/Packaging 2006, Messe für Systemintegration, 30. Mai-1. Juni 2006.
2. Du Pont: Process Guidelines QG150, http://www2.dupont.com/MCM/en_US/PDF/ techtip/OG150ProcessGiude.pdf
3. G.Reppe et al.: Development and Evaluation of Fine Line Structuring Methods for Microwave Packages in Satellite Applications, 15th European Microelectronics and Packaging Conference & Exhibition, June 12-15, 2005, Oud Sint Jan, Brugge, Belgium.
4. B.Dziurdzia, St.Novak, H.Thust, T.Frisch, E.Polzer, W.Gregorczyk, "High Frequency Characterization of Advanced Thick-Film Materials and Techniques", 43rd International Colloquium, Technical University of Ilmenau, September 21-24, 1998, pp.108-114.