High functional density low-temperature co-fired ceramic modules for satellite communications

35th European Microwave Conference 2005 - Conference Proceedings

Volumn 1, Issue , 2005, Pages 481-484

  Trabert, Johannes F ^a   Hein, Matthias A ^a   Müller, Jens ^b   Perrone, Rubén A ^a   Stephan, Ralf ^a   Thust, Heiko ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^b MSE Micro Systems Engineering GmbH & Co   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRIC LINES; IMPEDANCE MATCHING (ELECTRIC); LOGIC DESIGN; SCATTERING PARAMETERS; SEMICONDUCTOR SWITCHES; SWITCHING CIRCUITS;

DECOUPLING NETWORKS; EMBEDDED LAYERS; INTEGRATED ACTIVE SEMICONDUCTOR SWITCHING CIRCUITS; PASSIVE COMPONENTS;

SATELLITE COMMUNICATION SYSTEMS;

EID: 33847121772     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2005.1608898     Document Type: Conference Paper

References (6)

1. th International Student Seminar on Microwave Apllications of Novel Physical Phenomena, St. Petersburg Electrotechnical University "LETI", St. Petersburg, Russia, June 7-9, 2004.
2. A. Jacob et al., Interim Report of project KERAMIS (No. 50YB0313), DLR, Germany, unpublished.
3. R. Perrone et al., "Development and Evaluation of Photo-defined Elements for Microwave Modules in LTCC for Space Applications," 2005 EMPC, European Microelectronics and Packaging Conference, Brugge, Belgium, June 12-15, 2005.
4. th Int. Symposium on Microelectronics, Long Beach, California, USA, November 2004.
5. T.R. Suess, M.A. Skurski, "Fodel®, Photoprintable Thick Film; Materials and Processing", DuPont Company, Microcircuit Materials, RTP Research Triangle Park, North Carolina, USA, www.dupont.com/mcm/pdfs/fodel.pdf.
6. F.J. Schmückle, A. Jentzsch, W. Heinrich, J. Butz, M. Spinnler, "LTCC as MCM Substrate: Design of Strip-Line Structures and Flip-Chip Interconnects," 2001 IEEE MTT-S Int. Microwave Symposium Dig., vol. 3, pp. 1903-1906, June 2001.