Moisture ingress into organic laminates

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 1, 1999, Pages 104-110

  Pecht, Michael G ^a,b   Ardebili, Haleh ^b   Shukla, Anand A ^c   Hagge, John K ^d   Jennings, David ^d  

^a IEEE

^b UNIVERSITY OF MARYLAND   (United States)

^c Kulicke and Soffa   (United States)

^d Collins General Aviation Division ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; DIFFUSION IN SOLIDS; EPOXY RESINS; MATHEMATICAL MODELS; MOISTURE; PRINTED CIRCUIT BOARDS; SORPTION;

EQUILIBRIUM MOISTURE CONTENT; MOISTURE INGRESS;

PLASTIC LAMINATES;

EID: 0033354745     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.759359     Document Type: Article

References (12)

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