Conductive filament formation failure in a printed circuit board

Circuit World

Volumn 25, Issue 3, 1999, Pages 6-8

  Rogers, Keith ^a   Hillman, Craig ^a   Pecht, Michael ^a   Nachbor, Suzanne ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON MICROSCOPY; LEAKAGE CURRENTS; OPTICAL MICROSCOPY;

CONDUCTIVE FILAMENTS;

PRINTED CIRCUIT BOARDS;

EID: 0032636026     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129910268882     Document Type: Article

References (10)

1. Kohman, G., Hermance, H. and Downes, G. (1955), "Silver migration in electrical insulation", The Bell System Technical Journal, pp. 1115-47.
2. Krumbein, S. (1988), "Metallic electromigration phenomena", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 11 No. 1, pp. 5-15.
3. Lahti, J., Delaney, R. and Hines, J. (1979), "The characteristic wearout process in epoxy-glass printed circuits for high density electronic packaging", Proceedings of the 17th International Reliability Physics Symposium, pp. 39-43.
4. Lando, D., Mitchell, J. and Welsher, T. (1979), "Conductive anodic filament in reinforced polymeric dielectrics: formation and prevention", Proceedings of the 17th International Reliability Physics Symposium, pp. 51-63.
5. Pecht, M., Wu, B. and Jennings, D. (1992), "Conductive filament formation in printed wiring boards", 13th IEEE/CHMT International Electronics Manufacturing Technology Symposium, pp. 74-9.
6. Pecht, M., Hillman, C., Rogers, K. and Jennings, D. (1999), "Conductive filament formation: a potential reliability issue in laminated printed circuit cards with hollow fibers", IEEE Transactions on Electronics Packaging Manufacturing.
7. Rudra, B. and Jennings, D. (1994), "Failure-mechanism models for conductive-filament formation", IEEE Transactions on Reliability, Vol. 43 No. 3, pp. 354-60.
8. Rudra, B., Pecht, M. and Jennings, D. (1994), "Assessing time-to-failure due to conductive filament formation in multi-layer organic laminates", IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, Vol. 17 No. 3, pp. 269-76.
9. Shukla, A., Dishongh, T., Pecht, M. and Jennings, D. (1997a), "Hollow fibers in woven laminates", Printed Circuit Fabrication, Vol. 20 No. 1, pp. 30-2.
10. Shukla, A., Pecht, M., Jordan, J., Rogers, K. and Jennings, D. (1997b), "Hollow fibers in PCB, MCM-L and PBGA laminates may induce reliability degradation", Circuit World, Vol. 23 No. 2, pp. 5-6.