Hermetic sealing of microelectronics packages using a room temperature soldering process

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005

Volumn , Issue , 2005, Pages 286-290

  Rude, T ^a   Subramanian, J ^a   Levin, J ^a   Van Heerden, D ^a   Knio, O ^a   Powers, M ^b  

^a Reactive NanoTechnologies   (United States)

^b AGILENT TECHNOLOGIES   (United States)

Author keywords

Flux free; Hermetic sealing; Reactive multilayer foil; Room temperature process

Indexed keywords

FABRICATION EQUIPMENT; HERMETIC SEALING; MICROELECTRONIC PACKAGE; MICROELECTRONICS PACKAGES; MULTILAYER FOILS; REFLOW TEMPERATURES; ROOM-TEMPERATURE PROCESS; SOLDERING PROCESS;

HERMETIC SEALS; SOLDERING;

MICROELECTRONICS;

EID: 84876896900     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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10. J. Levin et al, "Room Temperature Lead-Free Soldering of Microelectronic Components Using a Local Heat Source," Paper presented at the 2004 ASM Materials Solutions Conference & Exposition, Columbus, Ohio, October 18-21, 2004.