Assessment of the reliability of high temperature electronics packaging technology

International Conference and Exhibition on High Temperature Electronics 2008, HiTEC 2008

Volumn , Issue , 2008, Pages 265-272

  Riches, S T ^a   Johnston, C ^b   Sousa, M ^b   Grant, P ^b   Gulliver, J ^c   Langley, M ^c   Pittson, R ^c   Firmstone, M ^d  

^a ANIMAL HEALTH TRUST   (United Kingdom)

^b UNIVERSITY OF OXFORD   (United Kingdom)

^c Sondex Wireline ^*  (United Kingdom)

^d Thermastrate Ltd   (United Kingdom)

Author keywords

High temperature electronics packaging; Microstructural analysis; Nano indentation; Reliability assessment

Indexed keywords

HIGH-TEMPERATURE ELECTRONICS; HIGH-TEMPERATURE ENVIRONMENT; HIGH-TEMPERATURE EXPOSURE; HIGHLY ACCELERATED TESTS; MICROSTRUCTURAL ANALYSIS; PERFORMANCE SPECIFICATIONS; RELIABILITY ASSESSMENTS; THERMAL CHARACTERISATION;

ELECTRONICS PACKAGING; RELIABILITY ANALYSIS;

ENGINEERING EXHIBITIONS;

EID: 84876916659     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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