The role of interfacial compound formation on package reliability

Advancing Microelectronics

Volumn 35, Issue 4, 2008, Pages 20-27

  Harris, Jonathan H ^a   Rubel, Erich ^a  

^a CMC Interconnect Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL PROPERTY; INTERFACIAL COMPOUND FORMATION; INTERFACIAL FAILURES; PACKAGE RELIABILITY; PACKAGING APPLICATIONS; STRESS-INDUCED; THERMAL AND ELECTRICAL CONDUCTIVITY;

CHEMICAL COMPOUNDS; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; TIN;

SEMICONDUCTING INTERMETALLICS;

EID: 67650720783     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. nd Edition, ASM, 1990
2. R.J. Fields and S.R. Low, NIST Metallurgy Division, Research Publication
3. See, for example, J.H. Harris and E. Rubel, Semiconductor International, September 2007
4. Zribi et al., 1999 ECTC Proceedings, IEEE, 451