Mill-Grinding with Electroplated Diamond Abrasives for Ceramic Cutting

International Journal of Precision Engineering and Manufacturing

Volumn 13, Issue 1, 2012, Pages 5-10

  Ko, Tae Jo ^a   Yoon, In Joon ^b  

^a Yeungnam University   (South Korea)

^b OSG Korea Co Ltd   (South Korea)

Author keywords

Cutting tools; Diamond; Electroplating; Engineering ceramics; Grinding

Indexed keywords

ABRASIVES; CUTTING TOOLS; DIAMONDS; ELECTROPLATING; GLASS INDUSTRY; GRINDING (MACHINING); GRINDING MILLS;

CUTTING EXPERIMENT; DIAMOND ABRASIVE; DUCTILE CUTTING; ENGINEERING CERAMIC; GRINDING PROCESS; INDUSTRIAL PRODUCT; MATERIAL REMOVAL RATE; PROCESS EFFICIENCY;

DIAMOND CUTTING TOOLS;

EID: 84876579391     PISSN: 22347593     EISSN: 20054602     Source Type: Journal    
DOI: 10.1007/s12541-012-0001-y     Document Type: Article

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