An experimental study on microcutting of silicon using a micromilling machine

International Journal of Advanced Manufacturing Technology

Volumn 39, Issue 1-2, 2008, Pages 85-91

  Rusnaldy, ^a   Ko, Tae Jo ^a   Kim, Hee Sool ^a  

^a Yeungnam University   (South Korea)

Author keywords

Ductile and brittle cutting mode; Force ratio; Micro end milling

Indexed keywords

BRITTLENESS; CRYSTAL CUTTING; CUTTING; DIAMONDS; MACHINING; MICROMACHINING; MILLING (MACHINING); NONMETALS; SILICON; SINGLE CRYSTALS;

BRITTLE MATERIALS; CUTTING CONDITIONS; DUCTILE AND BRITTLE CUTTING MODE; DUCTILE REGIME; DUCTILE-MODE; END MILLS; EXPERIMENTAL STUDIES; FORCE RATIO; FREE-FORM SURFACES; MACHINING TECHNOLOGY; MICRO-CUTTING; MICRO-END-MILLING; MICRO-MILLING; SINGLE-CRYSTAL-SILICON; SMOOTH SURFACES; SUB SURFACE DAMAGE; TECHNOLOGICAL BARRIERS;

SILICON WAFERS;

EID: 52649179929     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-007-1211-9     Document Type: Article

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