Study of an on-line precision microgroove generating process on silicon wafer using a developed ultra-thin diamond wheel-tool

Diamond and Related Materials

Volumn 20, Issue 3, 2011, Pages 339-342

  Chen, Shun Tong ^a   Lin, Shing Jr ^a  

^a NATIONAL TAIWAN NORMAL UNIVERSITY   (Taiwan)

Author keywords

Co deposition; High speed and fast shallow grinding (HSFSG); Microgrooves; Wire electro discharge dressing (w EDD)

Indexed keywords

CATHODE DESIGN; CODEPOSITION; CURRENT CROWDING EFFECT; DIAMOND GRAINS; DIAMOND GRINDING WHEEL; DIAMOND WHEEL; DUCTILE GRINDING; ECONOMICAL METHODS; ELECTRODISCHARGES; HIGH-SPEED; MICRO WIRE; MICROGROOVES; REMOVAL MECHANISM; SURFACE CHARACTERISTICS; ULTRA-THIN;

ABRASIVES; DIAMONDS; EQUIPMENT; GRINDING (COMMINUTION); GRINDING (MACHINING); GRINDING MACHINES; GRINDING MILLS; GRINDING WHEELS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SURFACE ROUGHNESS; WIRE;

WHEEL DRESSING;

EID: 79551612687     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2011.01.033     Document Type: Article

References (8)

1. C.S. Lim, M.H. Hong, A.S. Kumar, M. Rahman, and X.D. Liuc International Journal of Machine Tools & Manufacture 46 2006 552
2. S. Nikumb, Q. Chen, C. Li, H. Reshef, H.Y. Zheng, H. Qiu, and D. Low Thin Solid Films 477 2005 216
3. V. Sinhoff, and W. König CIRP Annals - Manufacturing Technology 47 1998 253
4. G. Cai, X. Xu, and R. Kang Key Engineering Materials 304-305 2006 81
5. T. Saleh, M.S. Rahman, H.S. Lim, and M. Rahman Journal of Materials Processing Technology 192-193 2007 287
6. M. Vogelaere De, V. Sommer, H. Springborn, and U.M. Mohammadein Electrochimica Acta 47 2001 109
7. Saito C., 1979. The Construction and 100% Operational Skills of EDM (in Japanese) Mitsubishi Electric Ltd. 40-69.
8. V.C. Venkatesh, I. Inasaki, H.K. Toenshoff, T. Nakagawa, and I.D. Marinescu Annals CIRP 44 2 1995 611