A 0.48V 0.57nJ/pixel video-recording SoC in 65nm CMOS

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 56, Issue , 2013, Pages 158-159

  Lin, Tay Jyi ^a   Chien, Cheng An ^a   Chang, Pei Yao ^a   Chen, Ching Wen ^b   Wang, Po Hao ^c   Shyu, Ting Yu ^a   Chou, Chien Yung ^b   Luo, Shien Chun ^b   Guo, Jiun In ^c   Chen, Tien Fu ^c   Chuang, Gene C H ^b   Chu, Yuan Hua ^b   Cheng, Liang Chia ^b   Su, Hong Men ^d   Jou, Chewnpu ^e   Ieong, Meikei ^e   Wu, Cheng Wen ^b   Wang, Jinn Shyan ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^d Andes Technology Inc   (Taiwan)

^e TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EXTERNAL MEMORY; FRAME BUFFER; H.264 ENCODERS; LOW-POWER TECHNOLOGY; ON-CHIP PERIPHERALS; ULTRA-LOW POWER; ULTRA-LOW-VOLTAGE; VOLTAGE-SCALING;

ENCODING (SYMBOLS); ENERGY DISSIPATION; ENERGY MANAGEMENT; INTEGRATED CIRCUITS; OPTIMIZATION; VIDEO RECORDING;

MICROPROCESSOR CHIPS;

EID: 84876558313     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2013.6487680     Document Type: Conference Paper

References (5)

1. L. F. Ding, et al., "A 212Mpixels/s 4096?2160p Multi-View Video Encoder Chip for 3D/Quad HDTV Applications," ISSCC Dig. Tech. Papers, pp. 154-155, 2009.
2. A. Wang, et al., "A 180mV FFT Processor Using Subthreshold Circuit Techniques," ISSCC Dig. Tech. Papers, pp. 292-293, 2004.
3. N. Verma and A. P. Chandrakasan, "A 256Kb 65nm 8T Subthreshold SRAM Employing Sense-Amplifier Redundancy," IEEE J. Solid-State Circuits, vol. 43, no. 1, pp. 141-149, 2008.
4. S. Das, et al., "A Self-Tuning DVS Processor Using Delay-Error Detection and Correction," IEEE J. Solid-State Circuits, vol. 41, no. 4, pp. 792-804, 2006.
5. T. J. Lin, et al., "Collaborative Voltage Scaling with Online STA and Variable-Latency Datapath," IEEE Great Lakes Symp. VLSI, pp. 347-352, 2010.