Design optimization of manifold microchannel heat sink through evolutionary algorithm coupled with surrogate model

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 4, 2013, Pages 617-624

  Husain, Afzal ^a,b   Kim, Kwang Yong ^a  

^a Inha University   (South Korea)

^b SULTAN QABOOS UNIVERSITY   (Oman)

Author keywords

Electronics cooling; evolutionary algorithm; manifolds; microchannels; multiobjective optimization; numerical simulation

Indexed keywords

3-D NUMERICAL ANALYSIS; CONJUGATE HEAT TRANSFER; ELECTRONICS COOLING; LATIN HYPERCUBE SAMPLING METHODS; MANIFOLD MICROCHANNEL HEAT SINKS; MULTI OBJECTIVE EVOLUTIONARY ALGORITHMS; OVERALL THERMAL RESISTANCE; RESPONSE SURFACE APPROXIMATION;

AUTOMOBILE ENGINE MANIFOLDS; COMPUTER SIMULATION; DESIGN; ELECTRONIC COOLING; EVOLUTIONARY ALGORITHMS; FINS (HEAT EXCHANGE); FUEL ADDITIVES; HEAT RESISTANCE; LAMINAR FLOW; MULTIOBJECTIVE OPTIMIZATION; NAVIER STOKES EQUATIONS; NOZZLE DESIGN; NOZZLES; PARETO PRINCIPLE;

MICROCHANNELS;

EID: 84875890586     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2245943     Document Type: Article

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