Electrical and thermal properties of low permittivity Sr2Al 2SiO7 ceramic filled HDPE composites

Ceramics International

Volumn 39, Issue 5, 2013, Pages 4945-4951

  Manu, K M ^a   Ananthakumar, S ^a   Sebastian, M T ^a  

^a REGIONAL RESEARCH LABORATORY CSIR   (India)

Author keywords

C. Thermal properties; D. Silicate; E. Substrate; Microwave dielectric properties

Indexed keywords

COEFFICIENT OF LINEAR THERMAL EXPANSION; E. SUBSTRATES; EFFECTIVE MEDIUM THEORIES; HIGH DENSITY POLYETHYLENE(HDPE); MICROWAVE DIELECTRIC PROPERTIES; PACKAGING APPLICATIONS; SCANNING ELECTRON MICROSCOPIC; THERMAL AND DIELECTRIC PROPERTIES;

CERAMIC MATERIALS; CHIP SCALE PACKAGES; DIELECTRIC LOSSES; DIELECTRIC PROPERTIES OF SOLIDS; ELECTRIC PROPERTIES; FILLERS; HOT PRESSING; PERMITTIVITY; SILICATES; THERMODYNAMIC PROPERTIES; VOLUME FRACTION;

THERMAL CONDUCTIVITY;

EID: 84875755571     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2012.11.090     Document Type: Article

References (37)

1. R. Tummala, M. Kosec, W.K. Jones, and D. Belavic Electronic Packaging for High Reliability; Low Cost Electronics 1999 Kluwer Academic Publishers The Netherlands: Dordrecht
2. K. Maexa, M.R. Baklanov, D. Shamiryan, F. Iacopi, S.H. Brongersma, and Z.S. Yanovitskaya Low dielectric constant materials for microelectronics Journal of Applied Physics 93 2003 8793 8841
3. D.D.L. Chung Materials for Electronic Packaging 1995 Butterworth Heinemann: Boston
4. M.T. Sebastian Dielectric Materials for Wireless Communication 2008 Elseiver Publishers Oxford, UK
5. H. Ohsato, T. Tsunooka, T. Sugiyama, K. Kakimoto, and H. Ogawa Forsterite ceramics for millimeterwave dielectrics Journal of Electroceramics 17 2006 445 450
6. T. Tsunooka, T. Sugiyama, H. Ohsato, K. Kakimoto, M. Andou, Y. Higashida, and H. Sugiura Development of forsterite with high Q and zero temperature coefficient TF for millimeterwave dielectric ceramics Key Engineering Materials 269 2004 199 202
7. 7 ceramic for microwave applications Materials Chemistry and Physics 133 2012 21 23
8. 13 (RE=La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Er, Tm, Yb, and Y) ceramics Journal of the American Ceramic Society 92 2009 2975 2981
9. 10 - LMZBS glass composite for LTCC applications Materials Letters 65 2011 565 567
10. A.J. Bur Dielectric properties of polymers at microwave frequencies: a review Polymer 26 1985 963 977
11. M.T. Sebastian, and H. Jantunen Polymer-ceramic composites of 0-3 connectivity for circuits in electronics: a review International Journal of Applied Ceramic Technology 7 2010 415 434
12. D.P. Button, B.A. Yost, R.H. French, W.Y. Hsu, J.D. Belt, M.A. Subrahmanian, H.-M. Zhang, R.E. Geidd, A.J. Whittacker, and D.G. Onn Ceramic-Fiber/Polymer Laminates: Thermally Conductive Composites With Low Dielectric Constants vol. 26 1989 American Ceramic Society Westerville, OH pp. 353-373
13. K.P. Murali, S. Rajesh, O. Prakash, A.R. Kulkarni, and R. Ratheesh Comparison of alumina and magnesia filled PTFE composites for microwave substrate applications Materials Chemistry and Physics 113 2009 290 295
14. 20 composites Journal of Polymer Research 10 2003 247 258
15. 2 - filled hdpe composites for microwave substrate applications Journal of Polymer Science Part B: Polymer Physics 48 2010 998 1008
16. 7 composites Journal of Materials Science: Materials in Electronics 22 2011 1000 1009
17. 15 ceramics reinforced high density polyethylene Journal of Physics D 42 2009 225501 225506
18. 3 composites for flexible microwave electronic applications, Ceramics International, 10.1016/j.ceramint.2012.09.047, in press.
19. 16 polymer ceramic composites for electronic packaging applications Journal of the European Ceramic Society 27 2007 3039 3044
20. 2 ceramic composites for microwave substrate applications International Journal of Applied Ceramic Technology 5 2008 325 333
21. S. George, P.S. Anjana, J. Krupka, S. Uma, J. Philip, and M.T. Sebastian Dielectric, mechanical and thermal properties of low-permittivity polymer-ceramic composites for microelectronic applications International Journal of Applied Ceramic Technology 7 2010 461 474
22. 3-delta filler on the microwave dielectric properties of polyethylene and polystyrene for microelectronic applications Polymer Engineering and Science 50 2010 570 576
23. 7 based polymer/ceramic composites Journal of Materials Science: Materials in Electronics 23 2012 1243 1254
24. J. Krupka, R.G. Geyer, J. Baker-Jarvis, J. Ceremuga, Conference on Precise Measurement Method for Complex Permittivity of Microwave Substrate, CPEM, 1988.
25. J. Krupka Frequency domain complex permittivity measurements at microwave frequencies Measurement Science and Technology 17 2006 R55 R70
26. W.J. Parker, R.J. Jenkins, C.P. Butler, and G.L. Abbot Flash method of determining thermal diffusivity heat capacity and thermal conducutivity Journal of Applied Physics 9 1961 1679 1684
27. P. Gonon, T.P. Hong, O. Lesaint, S. Bourdelais, and H. Debruyne Influence of high levels of water absorption on the resistivity and dielectric permittivity of epoxy composites Polymer Testing 24 2005 799 804
28. T.S. Laverghetta Microwave Materials and Fabrication Techniques 1984 Artech House USA
29. D.H. Kuo, C.C. Chang, T.Y. Su, W.K. Wang, and B.Y. Lin Dielectric properties of three ceramic/epoxy composites Materials Chemistry and Physics 85 2004 201 206
30. V.L. Gurevich, and A.K. Tagantsev Intrinsic dielectric loss in crystals Advances in Physics 40 1991 719 767
31. N. Jayasundere, and B.V. Smith Dielectric-constant for binary piezoelectric 0-3 composites Journal of Applied Physics 73 1993 2462 2466
32. Y. Rao, J.M. Qu, T. Marinis, and C.P. Wong A precise numerical prediction of effective dielectric constant for polymer-ceramic based on the effective-medium theory IEEE Transactions on Components and Packaging Technologies 23 2000 680 683
33. K. Wakino, T. Okada, N. Yoshida, and K. Tomono A new equation for predicting the dielectric constant of a mixture Journal of the American Ceramic Society 76 1993 2588 2594
34. B. Riddle, J.B. Jarvis, and J. Krupka Complex permittivity measurements of common plastics over variable temperatures IEEE Transactions on Microwave Theory and Techniques 51 2003 727 733
35. M.A. Berger, and R.L. McCullough Characterization and analysis of the electrical properties of a metal-filled polymer Composites Science and Technology 22 1985 81 106
36. G.M. Tsangaris, and G.C. Psarras The dielectric response of a polymeric three-component composite Journal of Materials Science 34 1999 2151 2157
37. W.D. Kingery Introduction to Ceramics 1960 John Wiley and Sons New York