Cure kinetics characterization and monitoring of an epoxy resin using DSC, Raman spectroscopy, and DEA

Composites Part A: Applied Science and Manufacturing

Volumn 49, Issue , 2013, Pages 100-108

  Hardis, Ricky ^a   Jessop, Julie L P ^b   Peters, Frank E ^a   Kessler, Michael R ^a,c  

^a Iowa State University   (United States)

^b University of Iowa   (United States)

^c IOWA STATE UNIVERSITY   (United States)

Author keywords

A. Thermosetting resin; B. Cure behavior; D. Process monitoring; D. Thermal analysis

Indexed keywords

CURE BEHAVIOR; CURE MONITORING; DIELECTRIC ANALYSIS; FIBER REINFORCED POLYMERS; ISOTHERMAL CONDITIONS; MANUFACTURING PROCESS; REACTION MODEL; WIND TURBINE BLADES;

DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FIBER REINFORCED PLASTICS; INDUSTRIAL APPLICATIONS; PROCESS MONITORING; RAMAN SPECTROSCOPY; RESINS; THERMOANALYSIS; THERMOSETS;

CURING;

EID: 84875452671     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2013.01.021     Document Type: Article

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