Development of a dielectric system for the on-line cure monitoring of the resin transfer moulding process

Composites Part A: Applied Science and Manufacturing

Volumn 31, Issue 12, 2000, Pages 1373-1381

  McIlhagger, A ^a   Brown, D ^a   Hill, B ^a  

^a Sch Elec Mech Eng Univ U   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CORRELATION METHODS; CURING; DIELECTRIC AMPLIFIERS; MONITORING; ONLINE SYSTEMS; SENSITIVITY ANALYSIS; THERMOANALYSIS; TRANSFER MOLDING;

DIELECTRIC ANALYSIS; ONLINE CURE MONITORING; RESIN TRANSFER MOLDING (RTM) PROCESS;

RESINS;

EID: 0034546084     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-835X(00)00050-6     Document Type: Article

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