Application of dielectric analysis for monitoring the cure process of phenol formaldehyde adhesive

International Journal of Adhesion and Adhesives

Volumn 27, Issue 7, 2007, Pages 562-567

  Sernek, Milan ^a   Kamke, Frederick A ^b  

^a UNIVERSITY OF LJUBLJANA   (Slovenia)

^b OREGON STATE UNIVERSITY   (United States)

Author keywords

Cure; Dielectric spectroscopy; Phenolic; Wood

Indexed keywords

CURING; DIELECTRIC SPECTROSCOPY; FORMALDEHYDE; PHENOLS; WOOD;

ADHESIVE BONDS; DIELECTRIC ANALYSIS; IMPEDANCE ANALYZER; WATER MOVEMENT;

ADHESIVES;

ADHESIVES; CURING; POLYPHENOLICS; WOOD;

EID: 34249014384     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2006.10.004     Document Type: Article

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