Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

Journal of Applied Polymer Science

Volumn 96, Issue 3, 2005, Pages 660-672

  Naffakh, Mohammed ^a   Dumon, Michel ^a   Dupuy, Jerôme ^a   Gérard, Jean François ^a  

^a Unite Mixte de Recherche   (France)

Author keywords

Blends; Curing; Differential scanning calorimetry (DSC); Kinetics; Modeling

Indexed keywords

ADHESION; AGING OF MATERIALS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; GELATION; MATHEMATICAL MODELS; ORGANIC POLYMERS; POLYMERIZATION; RESINS; RHEOLOGY; VISCOELASTICITY;

COLLOIDAL STATES; PHYSICAL GELATION; POLY(ETHYL IMIDE) (PEI); THIXOTROPY;

AROMATIC COMPOUNDS;

POLYMER SCIENCE;

EID: 17444391706     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.21495     Document Type: Article

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