Study of deposition patterns of plating layers in SiC/Cu composites by electro-brush plating

Applied Surface Science

Volumn 257, Issue 23, 2011, Pages 10294-10299

  Li, Xiangliang ^a,b   Wang, Xibao ^a,b   Gao, Rui ^a,b   Sun, Li ^a,b  

^a TIANJIN UNIVERSITY   (China)

^b TIANJIN KEY LABORATORY OF ADVANCED JOINING TECHNOLOGY   (China)

Author keywords

Deposition patterns; Electro brush plating; Growth mode; Plating layers; SiC

Indexed keywords

COPPER COMPOUNDS; GRAIN BOUNDARIES; HARDNESS; MICROSTRUCTURE; PLATING; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE;

DEPOSITION MECHANISM; DEPOSITION PATTERNS; ELECTRO BRUSH PLATING; GROWTH MODES; MICRO-STRUCTURAL CHARACTERIZATION; MICRO-STRUCTURE EVOLUTIONS; PLATING LAYER; SILICON CARBIDES (SIC);

COMPOSITE COATINGS;

EID: 80051796891     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2011.07.045     Document Type: Article

References (13)

1. C. Ming-li, Z. Ai-mei, and W. Jian-hua Hydride generation-atomic fluorescence spectrometric determination of cadmium in pure copper Chinese J. Anal. Chem. 35 2007 1339 1342
2. N.B. Dhokey, and R.K. Paretkar Study of wear mechanisms in copper-based SiCp (20% by volume) reinforced composite Wear 265 2008 117 133 (Pubitemid 351442864)
3. S.C. Wang, and W.C. Wei Kinetics of electroplating process of nano-sized ceramic particle/Ni composite Mater. Chem. Phys. 78 2003 574 580
4. H.T. Guo, and S.Y. Zhang Composite Plating Technology 2007 Press Chemical Industry 9-17
5. Z.A. Hamid, and A.A. Aal New environmentally friendly noncyanide alkaline electrolyte for copper electroplating Surf. Coat. Technol. 203 2009 1360 1365
6. 2 nano particles on carbon fiber reinforced epoxy composites Appl. Surf. Sci. 256 2009 1614 1616
7. 2 films J. Electrochem. Soc. 147 2000 59 70 (Pubitemid 30551887)
8. M. Schlesinger, and M. Paunovic Modern Electroplating 2000 John Wiley 19-21
9. 2 (110) Phys Rev B 47 1993 3868 3876
10. P. Bercot, E. Pena-munoz, and J. Pagetti Electrolytic composite Ni-PTFE coatings: an adaptation of Guglielmi's model for the phenomena of incorporation Surf. Coat. Technol. 157 2002 282 289 (Pubitemid 34834470)
11. V.F. Lins, E.S. Cecconello, and T. Matencio Effect of the current density on morphology, porosity, and tribological properties of electrodeposited nickel on copper J. Mater. Eng. Perform. 17 2008 741 745
12. Z.H. Ning, and Y.D. He Rapid electroplating of Cu coatings by mechanical attrition method Trans. Nonferrous Met. Soc. 18 2008 1100 1106
13. F.Z. Ren, G.S. Zhou, W.Z. Zhao, and M.S. Zheng Measurement of elastic modulus of films by three-point bend test Rare Met. Mater. Eng. 33 2004 109 112