The effect of pretreatment on adhesive strength of Cu-plated liquid crystal polymer (LCP)

Applied Surface Science

Volumn 258, Issue 7, 2012, Pages 2643-2647

  Zhou, Meisheng ^a   Zhang, Wenlong ^a   Ding, Dongyan ^a   Li, Ming ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Adhesive strength; Etching pretreatment; LCP film

Indexed keywords

COPPER; ELECTROLESS PLATING; ETCHING; FAILURE MODES; LIQUID CRYSTAL POLYMERS; METAL CLADDING; POTASH; SURFACE ROUGHNESS; WETTING;

ADHESIVE STRENGTH; COHESIVE FAILURES; COPPER METALLIZATION; HYDROPHILIC GROUPS; MECHANICAL INTERLOCKING; NANO-METER SCALE; POTASSIUM PERMANGANATE; PRE-TREATMENT;

COPPER PLATING;

EID: 84855533985     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2011.10.111     Document Type: Article

References (14)

1. X. Zhang, Q. Zhang, G. Zou, L. Chen, Z.N. Chen, and J.H. Liu Development of SOP module technology based on LCP substrate for high frequency electronics applications ESTC 2006: 1st Electron. Systemin. Technol. Conf. 2006 118 125
2. D.C. Thompson, O. Tantot, H. Jallageas, G.E. Ponchak, M.M. Tentzeris, and J. Papapolymerou Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 GHz IEEE Trans. Microw. Theory Tech. 52 2004 1343 1352
3. X.F. Wang, L.H. Lu, and C. Liu Micromachining techniques for liquid crystal polymer 14th IEEE Int. MEMS Conf. 2001 21 25
4. N. Kingsley, G.E. Ponchak, and J. Papapolymerou Reconfigurable RF MEMS phased array antenna integrated within a liquid crystal polymer (LCP) system-on-package IEEE Trans. Antennas Propag. 56 2008 108 118 (Pubitemid 351266693)
5. N. Kingsley, S.K. Bhattacharya, and J. Papapolymerou Moisture lifetime testing of RF MEMS switches packaged in liquid crystal polymer IEEE Trans. Compon. Packag. Technol. 31 2008 345 350
6. T. Suga, A. Takahashi, M. Howlader, K. Saijo, and S. Oosawa A lamination technique of LCP/Cu for electronic packaging 2nd Int. IEEE Conf. Polym. Adhes. Microelectron. Photon. 2002 177 182
7. M. Howlader, T. Suga, A. Takahashi, K. Saijo, S. Ozawa, and K. Nanbu Surface activated bonding of LCP/Cu for electronic packaging J. Mater. Sci. 40 2005 3177 3184 (Pubitemid 40834140)
8. R.N. Dean, J. Weller, M. Bozack, C.L. Rodekohr, B. Farrell, L. Jauniskis, J. Ting, D.J. Edell, and J.F. Hetke Realization of ultra fine pitch traces on LCP substrates IEEE Trans. Compon. Packag. Technol. 31 2008 315 321
9. J. Ge, M.P.K. Turunen, and J.K. Kivilahti Surface modification of a liquid-crystalline polymer forcopper metallization Polym. Sci. B: Polym. Phys. 41 2003 623 636
10. L. Chen, M. Crnic, Z.H. Lai, and J.H. Liu Process development and adhesion behavior of electroless copper on liquid crystal polymer (LCP) for electronic packaging application IEEE Trans. Electron. Packag. Manuf. 25 2002 273 278
11. T. Sugiyama, Y. Iimori, K. Baba, M. Watanabe, and H. Honma Surface metallization on high temperature liquid-crystal-polymer film by UV-irradiation process J. Electrochem. Soc. 156 D360 2009
12. E.M. Liston, L. Martinu, and M.R. Wertheimer Plasma surface modification of polymers for improved adhesion: a critical review J. Adhes. Sci. Technol. 7 10 1993 1091 1127
13. B. Wang, W. Eberhardt, and H. Kuck Adhesion of PVD layers on liquid crystal polymer pretreated by oxygen-containing plasma Vacuum 79 2005 129 133 (Pubitemid 41023647)
14. Y. Kurihara, H. Ohata, M. Kawaguchi, S. Yamazaki, and K. Kimura Improvement of adhesion and long-term adhesive reliability of liquid crystalline polyester film by plasma treatment J. Appl. Polym. Sci. 108 2008 85 92 (Pubitemid 351363266)