-
4
-
-
28944434210
-
Electronic device encapsulation using red phosphorus flame retardants
-
DOI 10.1016/j.microrel.2005.09.001, PII S0026271405003112
-
M. Pecht and Y. Deng, "Electronic device encapsulation using red phosphorus flame retardants," Microelectron. Reliab., vol. 46, no. 1, pp. 53-62, Jan. 2006. (Pubitemid 41782011)
-
(2006)
Microelectronics Reliability
, vol.46
, Issue.1
, pp. 53-62
-
-
Pecht, M.1
Deng, Y.2
-
5
-
-
72149133083
-
Solder ball attachment assessment of reballed plastic ball grid array packages
-
Dec
-
L. Nie, M. Osterman, F. Song, J. Lo, S. W. R. Lee, and M. Pecht, "Solder ball attachment assessment of reballed plastic ball grid array packages," IEEE Trans. Compon. Packag. Technol., vol. 32, no. 4, pp. 901-908, Dec. 2009.
-
(2009)
IEEE Trans. Compon. Packag. Technol.
, vol.32
, Issue.4
, pp. 901-908
-
-
Nie, L.1
Osterman, M.2
Song, F.3
Lo, J.4
Lee, S.W.R.5
Pecht, M.6
-
6
-
-
43049154693
-
No-fault-found and intermittent failures in electronic products
-
May
-
H. Qi, S. Ganesan, and M. Pecht, "No-fault-found and intermittent failures in electronic products," Microelectron. Reliab., vol. 48, no. 5, pp. 663-674, May 2008.
-
(2008)
Microelectron. Reliab.
, vol.48
, Issue.5
, pp. 663-674
-
-
Qi, H.1
Ganesan, S.2
Pecht, M.3
-
7
-
-
84874954688
-
-
Class Action Lawsuits, Recalls Defective Ford Ignition Modules Last accessed, May 24 2010, Jul. 30 2007
-
Class Action Lawsuits and Recalls, Defective Ford Ignition Modules, Last accessed, May 24, 2010, Jul. 30, 2007. [Online]. Available: http:// classactionlawsuit.blogspot.com/2007/07/defective-ford-ignition-modules. html
-
-
-
-
8
-
-
0036540125
-
The "trouble not identified" phenomenon in automotive electronics
-
DOI 10.1016/S0026-2714(02)00040-9, PII S0026271402000409
-
D. A. Thomas, K. Ayers, and M. Pecht, "The 'trouble not identified' phenomenon in automotive electronics," Microelectron. Reliab., vol. 42, no. 4/5, pp. 641-651, Apr./May 2002. (Pubitemid 34498208)
-
(2002)
Microelectronics Reliability
, vol.42
, Issue.4-5
, pp. 641-651
-
-
Thomas, D.A.1
Avers, K.2
Pecht, M.3
-
9
-
-
80053406771
-
-
The Associated Press, Last accessed, May 30 2010, Oct. 24, 2006
-
Y. Kageyama, "Sony Apologizes for Battery Recall," The Associated Press, Last accessed, May 30, 2010, Oct. 24, 2006. [Online]. Available: http://www.washingtonpost.com/wp-dyn/content/article/2006/10/24/ AR2006102400278-2.html
-
Sony Apologizes for Battery Recall
-
-
Kageyama, Y.1
-
10
-
-
85053746822
-
-
Beta News, Last accessed, May 24, 2010, Aug. 25, 2006
-
N. Mook, "Sony Battery Recall Cost: @@250 Million," Beta News, Last accessed, May 24, 2010, Aug. 25, 2006. [Online]. Available: http://www.betanews.com/article/Sony-Battery-Recall-Cost-250-Million/1156522330
-
Sony Battery Recall Cost: @@250 Million
-
-
Mook, N.1
-
11
-
-
84874990274
-
-
NVIDIA Corporation SEC Filing Form 8-K, July 2, 2008, Item 8.01, Last accessed, Oct. 25, 2010
-
NVIDIA Corporation SEC Filing, Form 8-K, July 2, 2008, Item 8.01, Last accessed, Oct. 25, 2010. [Online]. Available: http://www.sec.gov/Archives/edgar/ data/1045810/000119312508145974/d8k.htm
-
-
-
-
12
-
-
84861529822
-
-
Last Accessed May 24 2010 CDRInfo, Jul. 4
-
Last accessed, May 24, 2010 "NVIDIA Admits Problems with Certain GPU and MCP Products," CDRInfo, Jul. 4, 2008. [Online]. Available: http://www.cdrinfo.com/Sections/News/Details.aspx?NewsId=23649
-
(2008)
NVIDIA Admits Problems with Certain GPU and MCP Products
-
-
-
13
-
-
84874974542
-
-
NVIDIA Corporation SEC Filing, Last accessed, May 24, 2010 Form 10-K, for the Quarterly Period Ending May 2, 2010 Note 11 Guarantees (Product Defect) 17. [Online]. Available
-
NVIDIA Corporation SEC Filing, Last accessed, May 24, 2010 Form 10-K, for the Quarterly Period Ending May 2, 2010, Note 11, Guarantees (Product Defect), p. 17. [Online]. Available: http://www.sec.gov/Archives/edgar/data/1045810/ 000104581010000018/q111form10q.htm
-
-
-
-
14
-
-
84874984595
-
-
Big Download, Last accessed, May 24, 2010, Sep. 10 2008. [Online]. Available
-
J. Callaham, "NVIDIA Hit with Class Action Lawsuit," Big Download, Last accessed, May 24, 2010, Sep. 10, 2008. [Online]. Available: http://news.bigdownload.com/2008/09/10/NVIDIA-hit-with-class-action-lawsuit
-
NVIDIA Hit with Class Action Lawsuit
-
-
Callaham, J.1
-
15
-
-
84874991103
-
-
The NVIDIA GPU Litigation, U.S. District Court, Northern District of California, Last accessed, Oct. 25, 2010 Case C 08-04312 JW Stipulation and Agreement of Settlement and Release Docket No 238-1 filed August 16, 2010. [Online]. Available
-
The NVIDIA GPU Litigation, U.S. District Court, Northern District of California, Last accessed, Oct. 25, 2010 Case No. C 08-04312 JW, Stipulation and Agreement of Settlement and Release, Docket No. 238-1, filed August 16, 2010. [Online]. Available: https://ecf.cand.uscourts.gov/doc1/03517105375
-
-
-
-
16
-
-
0013181827
-
The phenomenon of zinc whisker growth and the rotary switch
-
Aug. Last accessed, May 24, 2010. Available
-
J. R. Downs and R. M. Francis (1994, Aug.). The phenomenon of zinc whisker growth and the rotary switch. Metal Finishing [Online]. 92(6), pp. 23-25, Last accessed, May 24, 2010. Available: http://nepp.nasa.gov/WHISKER/ reference/tech-papers/1994-downs-zinc-whisker-liability.pdf
-
(1994)
Metal Finishing
, vol.92
, Issue.6
, pp. 23-25
-
-
Downs, J.R.1
Francis, R.M.2
-
17
-
-
84874975385
-
Metal whiskers, a discussion of risks and mitigation
-
Nov.
-
J. Brusse, H. Leideker, and L. Panaschenko, "Metal whiskers, a discussion of risks and mitigation," in Proc. Environ. Technol. Tech. Symp. Workshop, Nov. 2010.
-
(2010)
Proc. Environ. Technol. Tech. Symp. Workshop
-
-
Brusse, J.1
Leideker, H.2
Panaschenko, L.3
-
18
-
-
84874977721
-
-
National Highway Traffic Safety Administration (NHTSA) Action Number: RQ10003, Unintended Acceleration in Various Toyota, Lexus and Pontiac Vehicles2010, Feb
-
National Highway Traffic Safety Administration (NHTSA) Action Number: RQ10003, Unintended Acceleration in Various Toyota, Lexus and Pontiac Vehicles2010, Feb.
-
-
-
-
19
-
-
84874959374
-
-
NASA Engineering and Safety Center Technical Report, Technical Support to the National Highway Traffic Safety Administration (NHTSA) on the Reported Toyota Motor Corporation Unintended Acceleration, Jan. 18
-
NASA Engineering and Safety Center Technical Report, Technical Support to the National Highway Traffic Safety Administration (NHTSA) on the Reported Toyota Motor Corporation Unintended Acceleration, Jan. 18, 2011.
-
(2011)
-
-
-
20
-
-
0037508132
-
-
Austin, TX: Int. SEMATECH
-
D. H. Eaton, N. Durrant, S. J. Huber, R. Blish, and N. Lycoudes, Knowledge-Based Reliability Qualification Testing of Silicon Devices. Austin, TX: Int. SEMATECH, 2000.
-
(2000)
Knowledge-Based Reliability Qualification Testing of Silicon Devices
-
-
Eaton, D.H.1
Durrant, N.2
Huber, S.J.3
Blish, R.4
Lycoudes, N.5
-
21
-
-
84874960850
-
-
Reliability Test Methods for Packaged Devices, JEDEC JESD 22 Series
-
Reliability Test Methods for Packaged Devices, JEDEC JESD 22 Series.
-
-
-
-
22
-
-
84874971803
-
-
Department of Defense, Test Method Standard Circuits, MIL STD 883 H, Feb.
-
Department of Defense, Test Method Standard Circuits, MIL STD 883 H, Feb. 2010.
-
(2010)
-
-
-
23
-
-
84875000932
-
-
Stress Test Driven Qualification of Integrated Circuits, JEDEC JESD 47 H, Feb.
-
Stress Test Driven Qualification of Integrated Circuits, JEDEC JESD 47 H, Feb. 2011.
-
(2011)
-
-
-
24
-
-
84874986043
-
-
Stress Test Qualification for Integrated Circuits, AEC Q100 Rev F
-
Stress Test Qualification for Integrated Circuits, AEC Q100 Rev F, 2003.
-
(2003)
-
-
-
25
-
-
77951778224
-
How to make a device into a product: Accelerated life testing its role, attributes, challenges, pitfalls, and interaction with qualification testing
-
E. Suhir, C. P. Wong, and Y. C. Lee, Eds. New York: Springer-Verlag
-
E. Suhir, "How to make a device into a product: Accelerated life testing its role, attributes, challenges, pitfalls, and interaction with qualification testing," in Micro-and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability, E. Suhir, C. P. Wong, and Y. C. Lee, Eds. New York: Springer-Verlag, 2007.
-
(2007)
Micro-and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability
-
-
Suhir, E.1
-
27
-
-
77950842130
-
-
Sematech Technology Transfer # 99083810A-XFR, Aug. 31
-
R. Blish, S. Huber, and N. Durrant, Use Condition Based Reliability Evaluation of New Semiconductor Technologies, Sematech Technology Transfer # 99083810A-XFR, Aug. 31, 1999.
-
(1999)
Use Condition Based Reliability Evaluation of New Semiconductor Technologies
-
-
Blish, R.1
Huber, S.2
Durrant, N.3
-
28
-
-
0038479878
-
-
Sematech 99083813A-XFR, Aug.
-
J. Veshinfsky, B. Purvee, R. Susko, J. McCullen, and N. Durrant, Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages, Sematech 99083813A-XFR, Aug. 1999.
-
(1999)
Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages
-
-
Veshinfsky, J.1
Purvee, B.2
Susko, R.3
McCullen, J.4
Durrant, N.5
-
30
-
-
0027632039
-
Role of failure mechanism identification in accelerated testing
-
Jul./Aug
-
J. Hu, D. Barker, A. Dasgupta, and A. Arora, "Role of failure mechanism identification in accelerated testing," J. IES, vol. 36, no. 4, pp. 39-45, Jul./Aug. 1993.
-
(1993)
J. IES
, vol.36
, Issue.4
, pp. 39-45
-
-
Hu, J.1
Barker, D.2
Dasgupta, A.3
Arora, A.4
-
31
-
-
0026923709
-
Failure mechanism models for brittle fracture
-
DOI 10.1109/24.159794
-
A. Dasgupta and J. Hu, "Failure mechanism model for brittle fracture," IEEE Trans. Rel., vol. 41, no. 3, pp. 328-335, Sep. 1992. (Pubitemid 23555749)
-
(1992)
IEEE Transactions on Reliability
, vol.41
, Issue.3
, pp. 328-335
-
-
Dasgupta Abhijit1
Hu Jun Ming2
-
32
-
-
0026971470
-
Failure mechanism models for ductile fracture
-
DOI 10.1109/24.249573
-
A. Dasgupta and J. Hu, "Failure mechanism model for ductile fracture," IEEE Trans. Rel., vol. 41, no. 4, pp. 489-495, Dec. 1992. (Pubitemid 23612224)
-
(1992)
IEEE Transactions on Reliability
, vol.41
, Issue.4
, pp. 489-495
-
-
Dasgupta, A.1
Jun Ming, H.2
-
33
-
-
0026883377
-
Failure mechanism models for plastic deformation
-
Jun
-
A. Dasgupta and J. Hu, "Failure mechanism models for plastic deformation," IEEE Trans. Rel., vol. 41, no. 2, pp. 168-174, Jun. 1992.
-
(1992)
IEEE Trans. Rel.
, vol.41
, Issue.2
, pp. 168-174
-
-
Dasgupta, A.1
Hu, J.2
-
34
-
-
84875001636
-
Failure mechanism models for creep and creep rupture
-
J. Li and A. Dasgupta, "Failure mechanism models for creep and creep rupture," Trans. Amer. Soc. Mech. Eng., vol. 115, pp. 416-423, 1993.
-
(1993)
Trans. Amer. Soc. Mech. Eng.
, vol.115
, pp. 416-423
-
-
Li, J.1
Dasgupta, A.2
-
35
-
-
0027814190
-
Failure mechanism models for cyclic fatigue
-
Dec
-
A. Dasgupta, "Failure mechanism models for cyclic fatigue," IEEE Trans. Rel., vol. 42, no. 4, pp. 548-555, Dec. 1993.
-
(1993)
IEEE Trans. Rel.
, vol.42
, Issue.4
, pp. 548-555
-
-
Dasgupta, A.1
-
37
-
-
84874982920
-
A strategy for enabling data driven product decisions through a comprehensive understanding of the usage environment
-
Kauai, HI, Jul.
-
D. Searls, T. Dishongh, and P. Dujari, "A strategy for enabling data driven product decisions through a comprehensive understanding of the usage environment," in Proc. Pacific RIM/ASME Int. Intersoc. Electron. Photon. Packag. Conf., Kauai, HI, Jul. 2001.
-
(2001)
Proc. Pacific RIM/ASME Int. Intersoc. Electron. Photon. Packag. Conf
-
-
Searls, D.1
Dishongh, T.2
Dujari, P.3
-
38
-
-
13444280619
-
Remaining life prediction of electronic products using life consumption monitoring approach
-
Cracow, Poland, Jun.
-
S. Mishra, M. Pecht, T. Smith, I. McNee, and R. Harris, "Remaining life prediction of electronic products using life consumption monitoring approach," in Proc. Eur. Microelectron. Packag. Interconnection Symp., Cracow, Poland, Jun. 2002, pp. 136-142.
-
(2002)
Proc. Eur. Microelectron. Packag. Interconnection Symp
, pp. 136-142
-
-
Mishra, S.1
Pecht, M.2
Smith, T.3
McNee, I.4
Harris, R.5
-
39
-
-
0142227054
-
A life consumption monitoring methodology for electronic systems
-
Sep
-
A. Ramakrishnan and M. Pecht, "A life consumption monitoring methodology for electronic systems," IEEE Trans. Compon. Packag. Technol., vol. 26, no. 3, pp. 625-634, Sep. 2003.
-
(2003)
IEEE Trans. Compon. Packag. Technol.
, vol.26
, Issue.3
, pp. 625-634
-
-
Ramakrishnan, A.1
Pecht, M.2
-
40
-
-
84875003170
-
-
Tech Brief Last Accessed, Jul. 1, 2009. [Online]. Available
-
Tech Brief, Last accessed, Jul. 1, 2009. [Online]. Available: http://laptops.toshiba.com/content/pc/b2c/downloads/tech-brief-pdfs/ Laptop-Health-Monitoring.pdf
-
-
-
-
41
-
-
74449085807
-
Parameter selection for health monitoring of electronic products
-
Feb
-
S. Kumar, E. Dolev, and M. Pecht, "Parameter selection for health monitoring of electronic products," Microelectron. Reliab., vol. 50, no. 2, pp. 161-168, Feb. 2010.
-
(2010)
Microelectron. Reliab.
, vol.50
, Issue.2
, pp. 161-168
-
-
Kumar, S.1
Dolev, E.2
Pecht, M.3
-
42
-
-
70349236857
-
Baseline performance of notebook computers under various environmental and usage conditions for prognostics
-
Sep
-
S. Kumar and M. Pecht, "Baseline performance of notebook computers under various environmental and usage conditions for prognostics," IEEE Trans. Compon. Packag.Technol., vol. 32, no. 3, pp. 667-676, Sep. 2009.
-
(2009)
IEEE Trans. Compon. Packag.Technol.
, vol.32
, Issue.3
, pp. 667-676
-
-
Kumar, S.1
Pecht, M.2
-
43
-
-
84875000359
-
-
Ph.D. dissertation, Univ. Maryland, College Park, MD
-
S. Kumar, "Development of diagnostic and prognostic methodologies for electronic systems based on Mahalanobis distance," Ph.D. dissertation, Univ. Maryland, College Park, MD, 2009.
-
(2009)
Development of Diagnostic and Prognostic Methodologies for Electronic Systems Based on Mahalanobis Distance
-
-
Kumar, S.1
-
44
-
-
76849109288
-
A prognostics and health management roadmap for information and electronics-rich systems
-
Mar.
-
R. Jaai and M. Pecht, "A prognostics and health management roadmap for information and electronics-rich systems," Microelectron. Reliab., vol. 50, no. 3, pp. 317-323, Mar. 2010.
-
(2010)
Microelectron. Reliab.
, vol.50
, Issue.3
, pp. 317-323
-
-
Jaai, R.1
Pecht, M.2
-
45
-
-
84874977259
-
Virtual qualification of electronic hardware
-
W. R. Blischke and D. N. P. Murthy, Eds. Hoboken, NJ: Wiley
-
M. Osterman, A. Dasgupta, and T. Stadterman, "Virtual qualification of electronic hardware," in Case Studies in Reliability and Maintenance, W. R. Blischke and D. N. P. Murthy, Eds. Hoboken, NJ: Wiley, 2003.
-
(2003)
Case Studies in Reliability and Maintenance
-
-
Osterman, M.1
Dasgupta, A.2
Stadterman, T.3
-
46
-
-
70449130539
-
Advanced process & product reliability development in fabless environment
-
Montreal, QC, Canada, Apr. 26-30
-
G. Verma, K. Wu, B. Euzent, and C. Huang, "Advanced process & product reliability development in fabless environment," in Proc. IEEE Int. Rel. Phys. Symp., Montreal, QC, Canada, Apr. 26-30, 2009, pp. 236-243.
-
(2009)
Proc. IEEE Int. Rel. Phys. Symp
, pp. 236-243
-
-
Verma, G.1
Wu, K.2
Euzent, B.3
Huang, C.4
-
49
-
-
84874963878
-
-
Last accessed, Mar. 31, 2010 Toyota Recall Launches CTS out of Obscurity, USA Today, Last accessed, Mar. 31, 2010, Jan. 29 2010. [Online]. Available
-
Last accessed, Mar. 31, 2010 Toyota Recall Launches CTS out of Obscurity, USA Today, Last accessed, Mar. 31, 2010, Jan. 29, 2010. [Online]. Available: http://www.usatoday.com/money/autos/2010-01-29-toyotacts29-CV-N.htm
-
-
-
|