-
1
-
-
0036540125
-
The 'trouble not identified' phenomenon in automotive electronics
-
No. 10
-
Thomas D.A., Ayers K., and Pecht M. The 'trouble not identified' phenomenon in automotive electronics. Microelectron Reliab 42 4-5 (2002) 641-651 No. 10
-
(2002)
Microelectron Reliab
, vol.42
, Issue.4-5
, pp. 641-651
-
-
Thomas, D.A.1
Ayers, K.2
Pecht, M.3
-
2
-
-
43049182035
-
-
IEEE 100 The Authoritative Dictionary of IEEE Standards Terms. 7th ed. Published by Standards Information Network IEEE Press; 2000.
-
IEEE 100 The Authoritative Dictionary of IEEE Standards Terms. 7th ed. Published by Standards Information Network IEEE Press; 2000.
-
-
-
-
3
-
-
85039971989
-
-
Sorensen BA, Kelly G, Sajecki A, Sorensen PW. An analyzer for detecting aging faults in electronic devices. In: AUTOTESTCON '94. IEEE systems readiness technology conference. 'Cost effective support into the next century', conference proceedings, September 20-22; 1994. p. 417-21.
-
Sorensen BA, Kelly G, Sajecki A, Sorensen PW. An analyzer for detecting aging faults in electronic devices. In: AUTOTESTCON '94. IEEE systems readiness technology conference. 'Cost effective support into the next century', conference proceedings, September 20-22; 1994. p. 417-21.
-
-
-
-
4
-
-
0033341427
-
Physics-of-failure assessment of a cruise control module
-
Kimseng K., Hoit M., and Pecht M. Physics-of-failure assessment of a cruise control module. Microelectron Reliab 39 10 (1999) 1423-1444
-
(1999)
Microelectron Reliab
, vol.39
, Issue.10
, pp. 1423-1444
-
-
Kimseng, K.1
Hoit, M.2
Pecht, M.3
-
5
-
-
0026966054
-
Are components still the major problem: a review of electronic system and device field failure returns
-
Pecht M., and Ramappan V. Are components still the major problem: a review of electronic system and device field failure returns. IEEE Trans CHMT 15 6 (1992) 1160-1164
-
(1992)
IEEE Trans CHMT
, vol.15
, Issue.6
, pp. 1160-1164
-
-
Pecht, M.1
Ramappan, V.2
-
6
-
-
0029472785
-
-
Johnson P, Rabe D. Detecting intermittent test failures with the aid of environmental stress screening. In: AUTOTESTCON '95. Systems readiness: test technology for the 21st century. Conference record; 1995. p. 127-34.
-
Johnson P, Rabe D. Detecting intermittent test failures with the aid of environmental stress screening. In: AUTOTESTCON '95. Systems readiness: test technology for the 21st century. Conference record; 1995. p. 127-34.
-
-
-
-
7
-
-
43049170611
-
-
Maher, editor. No-fault finder; May 2000. [accessed on 03.10.02].
-
Maher, editor. No-fault finder; May 2000. [accessed on 03.10.02].
-
-
-
-
8
-
-
0012318692
-
-
IEEE Press, New York, NY
-
Chan H.A., and Englert P.J. Accelerated stress testing handbook, guide for achieving quality products (2001), IEEE Press, New York, NY
-
(2001)
Accelerated stress testing handbook, guide for achieving quality products
-
-
Chan, H.A.1
Englert, P.J.2
-
9
-
-
43049180096
-
-
Sorensen B. Digital averaging - the smoking gun behind 'No-Fault-Found', air safety week, February 24; 2003, [accessed 17.09.06].
-
Sorensen B. Digital averaging - the smoking gun behind 'No-Fault-Found', air safety week, February 24; 2003, [accessed 17.09.06].
-
-
-
-
10
-
-
43049162942
-
-
Castelli J, Nash C, Ditlow C, Pecht M. Sudden acceleration: the myth of driver error. CALCE EPSC Press, University of Maryland, College Park, Maryland; 2003.
-
Castelli J, Nash C, Ditlow C, Pecht M. Sudden acceleration: the myth of driver error. CALCE EPSC Press, University of Maryland, College Park, Maryland; 2003.
-
-
-
-
12
-
-
43049166050
-
-
OPS ALACARTE Company, Reliability services in the design phase: sneak circuit analysis (hardware or software), ; 2006 [accessed 17.09.06].
-
OPS ALACARTE Company, Reliability services in the design phase: sneak circuit analysis (hardware or software), ; 2006 [accessed 17.09.06].
-
-
-
-
13
-
-
43049172389
-
-
Rink J. New toll-free number and web site help AAA deter insurance fraud, July 11; 2005, [accessed 17.09.06].
-
Rink J. New toll-free number and web site help AAA deter insurance fraud, July 11; 2005, [accessed 17.09.06].
-
-
-
-
14
-
-
43049162943
-
-
Ganesan S, Eveloy V, Das D, Pecht M. Identification and utilization of failure mechanisms to enhance FMEA and FMECA. In: Proceedings of the IEEE Workshop on Accelerated Stress Testing & Reliability (ASTR), Austin, Texas, October 2-5; 2005.
-
Ganesan S, Eveloy V, Das D, Pecht M. Identification and utilization of failure mechanisms to enhance FMEA and FMECA. In: Proceedings of the IEEE Workshop on Accelerated Stress Testing & Reliability (ASTR), Austin, Texas, October 2-5; 2005.
-
-
-
-
16
-
-
43049158239
-
-
Boehm H. Threads cannot be implemented as a library, November 12; 2004, [accessed 17.09.06].
-
Boehm H. Threads cannot be implemented as a library, November 12; 2004, [accessed 17.09.06].
-
-
-
-
17
-
-
43049170607
-
-
Nektek Inc., Analytic Laboratory Services Report, [accessed 17.09. 06].
-
Nektek Inc., Analytic Laboratory Services Report, [accessed 17.09. 06].
-
-
-
-
18
-
-
43049153498
-
-
Electrochemical migration: electrically induced failures in printed wiring assemblies, IPC-TR-476A, The Institute for Interconnecting and Packaging Electronic Circuits, Northbrook, IL, IPC; 1997.
-
Electrochemical migration: electrically induced failures in printed wiring assemblies, IPC-TR-476A, The Institute for Interconnecting and Packaging Electronic Circuits, Northbrook, IL, IPC; 1997.
-
-
-
-
19
-
-
43049178530
-
-
Bumiller E, Pecht M, Hillman C. Electrochemical migration on HASL plated FR-4 printed circuit boards. In: The 9th pan pacific microelectronics symposium exhibits & conference, Kahuku, Oahu, Hawaii; February 2004.
-
Bumiller E, Pecht M, Hillman C. Electrochemical migration on HASL plated FR-4 printed circuit boards. In: The 9th pan pacific microelectronics symposium exhibits & conference, Kahuku, Oahu, Hawaii; February 2004.
-
-
-
-
20
-
-
0032636026
-
Conductive filament formation failure in a printed circuit board
-
Rogers K., Hillman C., Pecht M., and Nachbor S. Conductive filament formation failure in a printed circuit board. Circuit World 25 3 (1999) 6-8
-
(1999)
Circuit World
, vol.25
, Issue.3
, pp. 6-8
-
-
Rogers, K.1
Hillman, C.2
Pecht, M.3
Nachbor, S.4
-
21
-
-
0033338114
-
Conductive filament formation: a potential reliability issue in laminated printed circuit cards with hollow fibers
-
Pecht M., Hillman C., Rogers K., and Jennings D. Conductive filament formation: a potential reliability issue in laminated printed circuit cards with hollow fibers. IEEE/CPMT 22 1 (1999) 60-67
-
(1999)
IEEE/CPMT
, vol.22
, Issue.1
, pp. 60-67
-
-
Pecht, M.1
Hillman, C.2
Rogers, K.3
Jennings, D.4
-
22
-
-
33748332802
-
Hollow fibers can accelerate conductive filament formation
-
Pecht M., Rogers K., and Hillman C. Hollow fibers can accelerate conductive filament formation. ASM Int Pract Failure Anal 1 4 (2001) 57-60
-
(2001)
ASM Int Pract Failure Anal
, vol.1
, Issue.4
, pp. 57-60
-
-
Pecht, M.1
Rogers, K.2
Hillman, C.3
-
23
-
-
43049158238
-
-
Electroless Nickel Plating, Quality metal Finishing Guide, Metal Finishing Suppliers' Association. vol. 1. No. 1; 2005.
-
Electroless Nickel Plating, Quality metal Finishing Guide, Metal Finishing Suppliers' Association. vol. 1. No. 1; 2005.
-
-
-
-
24
-
-
43049182033
-
-
Biunno N. A root cause failure mechanism of solder joint integrity of electroless nickel/immersion gold surface finishes. SMTA, October 12-16; 1999.
-
Biunno N. A root cause failure mechanism of solder joint integrity of electroless nickel/immersion gold surface finishes. SMTA, October 12-16; 1999.
-
-
-
-
25
-
-
43049166048
-
-
Mei, Z. A failure analysis and rework method of electronic assembly on electroless Ni/Immersion gold surface finish. SMTA, September 12-16; 1999.
-
Mei, Z. A failure analysis and rework method of electronic assembly on electroless Ni/Immersion gold surface finish. SMTA, September 12-16; 1999.
-
-
-
-
26
-
-
43049164514
-
-
Bulwith RA, Trosky M, Picchione LM, Hug D. The black pad failure mechanism from beginning to end, Global SMT & Packaging; September 2002. p. 9-13, ; 2002 [accessed 20.01.06].
-
Bulwith RA, Trosky M, Picchione LM, Hug D. The black pad failure mechanism from beginning to end, Global SMT & Packaging; September 2002. p. 9-13, ; 2002 [accessed 20.01.06].
-
-
-
-
27
-
-
33745299633
-
The root cause of black pad failure of solder joints with electroless Ni/immersion gold plating
-
Zeng K., Stierman R., Abbott D., and Murtuza M. The root cause of black pad failure of solder joints with electroless Ni/immersion gold plating. J Miner 58 6 (2006) 75-79
-
(2006)
J Miner
, vol.58
, Issue.6
, pp. 75-79
-
-
Zeng, K.1
Stierman, R.2
Abbott, D.3
Murtuza, M.4
-
29
-
-
0031337550
-
-
Murrell SR, McCarthy SL. Intermittence detection in fretting corrosion studies of electrical contacts. In: Proc. 43rd IEEE Holm conference on electrical contacts; 1997. p. 1-6.
-
Murrell SR, McCarthy SL. Intermittence detection in fretting corrosion studies of electrical contacts. In: Proc. 43rd IEEE Holm conference on electrical contacts; 1997. p. 1-6.
-
-
-
-
30
-
-
0033327623
-
-
Hubner-Obenland F, Minuth J. A new test equipment for high dynamic real-time measuring of contact resistances. In: Proc. 45th IEEE Holm conference on electrical contacts; 1999. p. 193-202.
-
Hubner-Obenland F, Minuth J. A new test equipment for high dynamic real-time measuring of contact resistances. In: Proc. 45th IEEE Holm conference on electrical contacts; 1999. p. 193-202.
-
-
-
-
31
-
-
0034497292
-
-
Malucci RD. Possible mechanism for observed dynamic resistance. In: Proc. 46th IEEE Holm conference on electrical contacts; 2000. p. 257-67.
-
Malucci RD. Possible mechanism for observed dynamic resistance. In: Proc. 46th IEEE Holm conference on electrical contacts; 2000. p. 257-67.
-
-
-
-
32
-
-
2342527055
-
-
Wu J, Pecht M. Contact resistance and fretting corrosion of lead-free alloy coated electrical contacts. In: Proceedings of the international IEEE conference on the Asian green electronics; 2004. p. 127-35.
-
Wu J, Pecht M. Contact resistance and fretting corrosion of lead-free alloy coated electrical contacts. In: Proceedings of the international IEEE conference on the Asian green electronics; 2004. p. 127-35.
-
-
-
-
34
-
-
43049180424
-
-
Lei K, Llinas J, Gwaltney M. Flexure induced failure of BGA solder joints. SMTA International, Surface Mount Technology Association; 1999 [September 12].
-
Lei K, Llinas J, Gwaltney M. Flexure induced failure of BGA solder joints. SMTA International, Surface Mount Technology Association; 1999 [September 12].
-
-
-
-
35
-
-
0037651062
-
Field failure due to creep corrosion on components with palladium pre-plated leadframes
-
Zhao P., and Pecht M. Field failure due to creep corrosion on components with palladium pre-plated leadframes. Microelectron Reliab 43 5 (2003) 775-778
-
(2003)
Microelectron Reliab
, vol.43
, Issue.5
, pp. 775-778
-
-
Zhao, P.1
Pecht, M.2
-
36
-
-
43049158236
-
-
.
-
.
-
-
-
-
37
-
-
43049176869
-
-
Zhang Y, Xu C, Abys J, Vysotskaya A. Understanding Whisker Phenomenon, Whisker Index and Tin/Copper, Tin/Nickel Interface, IPC SMEMA Council, APEX; 2002.
-
Zhang Y, Xu C, Abys J, Vysotskaya A. Understanding Whisker Phenomenon, Whisker Index and Tin/Copper, Tin/Nickel Interface, IPC SMEMA Council, APEX; 2002.
-
-
-
-
38
-
-
43049169039
-
-
Cunningham K, Donahue M. Tin Whiskers: mechanisms of growth and prevention. In: Proceedings of the 4th international SAMPE electronics conference; June 1990. p. 569-75.
-
Cunningham K, Donahue M. Tin Whiskers: mechanisms of growth and prevention. In: Proceedings of the 4th international SAMPE electronics conference; June 1990. p. 569-75.
-
-
-
-
39
-
-
85018149748
-
-
McDowell ME. Tin Whiskers: a case study (USAF). In: Proceedings of the aerospace applications conference; 1993. p. 207-15.
-
McDowell ME. Tin Whiskers: a case study (USAF). In: Proceedings of the aerospace applications conference; 1993. p. 207-15.
-
-
-
-
40
-
-
84889476995
-
-
Wiley-Interscience, New Jersey [p. 140-50, Chapter 10]
-
Ganesan S., and Pecht M. Lead-free electronics (2006), Wiley-Interscience, New Jersey [p. 140-50, Chapter 10]
-
(2006)
Lead-free electronics
-
-
Ganesan, S.1
Pecht, M.2
-
41
-
-
0036448529
-
-
Chudnovsky BH. Degradation of power contacts in industrial atmosphere: silver corrosion and whiskers. In: Proceedings of the 48th IEEE Holm conference on electrical contacts, Orlando, Florida; 2002. p. 140-50.
-
Chudnovsky BH. Degradation of power contacts in industrial atmosphere: silver corrosion and whiskers. In: Proceedings of the 48th IEEE Holm conference on electrical contacts, Orlando, Florida; 2002. p. 140-50.
-
-
-
-
42
-
-
43049180092
-
-
Brusse J, Ewell G, Siplon J. Tin whiskers: attributes and mitigation. In: Capacitor and resistor technology symposium (CARTS 02), New Orleans, LA, March 25-29; 2002. p. 221-33.
-
Brusse J, Ewell G, Siplon J. Tin whiskers: attributes and mitigation. In: Capacitor and resistor technology symposium (CARTS 02), New Orleans, LA, March 25-29; 2002. p. 221-33.
-
-
-
-
43
-
-
2442435849
-
Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures
-
Oldervoll F., and Strisland F. Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures. Microelectron Reliab 44 (2004) 1009-1015
-
(2004)
Microelectron Reliab
, vol.44
, pp. 1009-1015
-
-
Oldervoll, F.1
Strisland, F.2
-
44
-
-
43049164513
-
-
Pooch M-H, Dittmer KJ, Gabisch D. Investigations on the damage mechanism of aluminum wire bonds used for high power applications. In: Proceedings of the EUPAC 96; 1996. p. 128-31.
-
Pooch M-H, Dittmer KJ, Gabisch D. Investigations on the damage mechanism of aluminum wire bonds used for high power applications. In: Proceedings of the EUPAC 96; 1996. p. 128-31.
-
-
-
-
45
-
-
0033147361
-
Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules
-
Hamidi A., Beck N., Thomas K., and Herr E. Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules. Microelectron Reliab 39 (1999) 1153-1158
-
(1999)
Microelectron Reliab
, vol.39
, pp. 1153-1158
-
-
Hamidi, A.1
Beck, N.2
Thomas, K.3
Herr, E.4
-
47
-
-
0030652545
-
-
Held M, Jacob P, Nicolctti G, Scacco P, Pooch, M-H, Fast power cycling test for IGBT modules in traction application. In: Proceedings of the PEDS 97; 1997. p. 425-30.
-
Held M, Jacob P, Nicolctti G, Scacco P, Pooch, M-H, Fast power cycling test for IGBT modules in traction application. In: Proceedings of the PEDS 97; 1997. p. 425-30.
-
-
-
-
49
-
-
0030166337
-
Tutorial: soft errors induced by alpha particles
-
Lantz II L. Tutorial: soft errors induced by alpha particles. IEEE Trans Reliab 45 2 (1996) 174-179
-
(1996)
IEEE Trans Reliab
, vol.45
, Issue.2
, pp. 174-179
-
-
Lantz II, L.1
-
50
-
-
4544358471
-
Accelerated testing and finite element analysis of PBGA under multiple environmental loadings
-
Qi H., Ganesan A., Osterman M., and Pecht M. Accelerated testing and finite element analysis of PBGA under multiple environmental loadings. IEEE Business Electron Product Reliab Liab 27-30 April (2004) 99-106
-
(2004)
IEEE Business Electron Product Reliab Liab
, vol.27-30
, Issue.April
, pp. 99-106
-
-
Qi, H.1
Ganesan, A.2
Osterman, M.3
Pecht, M.4
-
51
-
-
10444256437
-
-
Qi H, Wilkinison C, Osterman M, Pecht M. Failure analysis and virtual qualification of PBGA under multiple environmental loadings. In: Proceedings of 54th electronic components and technology conference, Las Vegas, Nevada, June 1-4; 2004. p. 413-20.
-
Qi H, Wilkinison C, Osterman M, Pecht M. Failure analysis and virtual qualification of PBGA under multiple environmental loadings. In: Proceedings of 54th electronic components and technology conference, Las Vegas, Nevada, June 1-4; 2004. p. 413-20.
-
-
-
-
52
-
-
34249877943
-
Plastic ball grid array solder joint reliability for avionics applications
-
June
-
Qi H., Osterman M., and Pecht M. Plastic ball grid array solder joint reliability for avionics applications. IEEE Trans Compon Packag Technol 30 2 (2007) 242-247 June
-
(2007)
IEEE Trans Compon Packag Technol
, vol.30
, Issue.2
, pp. 242-247
-
-
Qi, H.1
Osterman, M.2
Pecht, M.3
-
53
-
-
43049170759
-
-
Guidelines for accelerated reliability testing of surface mount attachments, IPC-SM-785, Institute of Interconnecting and Packaging Electronic Circuits, Northbrook, IL; November 1992.
-
Guidelines for accelerated reliability testing of surface mount attachments, IPC-SM-785, Institute of Interconnecting and Packaging Electronic Circuits, Northbrook, IL; November 1992.
-
-
-
|