메뉴 건너뛰기




Volumn , Issue , 2009, Pages 236-243

Advanced process & product reliability development in fabless environment

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED PROCESS; ADVANCED TECHNOLOGY; FABLESS; MANUFACTURING IS; PRODUCT RELIABILITY; RELIABILITY DATA; TECHNOLOGY DEVELOPMENT;

EID: 70449130539     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IRPS.2009.5173256     Document Type: Conference Paper
Times cited : (4)

References (2)
  • 2
    • 56649091298 scopus 로고    scopus 로고
    • Robin C.J. Wang, K.S. Chang-Liao, T.K. Wang, M.N. Chang, C.S. Wang, C.H. Lin, C.C. Lee, C.C. Chiu, Kenneth Wu, Electrical Conduction and TDDB Reliability Characterization for Low-K SiCO Dielectric in Cu Interconnects, Thin Solid Films, pp.1230-1233, (2008) 517
    • Robin C.J. Wang, K.S. Chang-Liao, T.K. Wang, M.N. Chang, C.S. Wang, C.H. Lin, C.C. Lee, C.C. Chiu, Kenneth Wu, "Electrical Conduction and TDDB Reliability Characterization for Low-K SiCO Dielectric in Cu Interconnects, "Thin Solid Films, pp.1230-1233, (2008) 517


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.