Silver oxalate-based solders: New materials for high thermal conductivity microjoining

Scripta Materialia

Volumn 68, Issue 8, 2013, Pages 623-626

  Kiryukhina, K ^a,b,c,d   Le Trong, H ^b,e   Tailhades, Ph ^b,c   Lacaze, J ^b,c   Baco, V ^b,c   Gougeon, M ^b,c   Courtade, F ^a   Dareys, S ^a   Vendier, O ^d   Raynaud, L ^d  

^a CNES   (France)

^b UNIVERSITÉ PAUL SABATIER   (France)

^c INSTITUT CARNOT CIRIMAT   (France)

^d THALES ALENIA SPACE   (France)

^e UNIVERSITY OF NATURAL SCIENCES   (Viet Nam)

Author keywords

Joining; Microelectronic packaging; Silver oxalate; Soldering; Thermal conductivity

Indexed keywords

HIGH THERMAL CONDUCTIVITY; LOW PRESSURES; METALLIC SILVER; MICRO-JOINING; MICROELECTRONIC PACKAGING; MODERATE TEMPERATURE; NANOMETRICS;

JOINING; MICROELECTRONICS; SILVER; SINTERING; SOLDERING;

THERMAL CONDUCTIVITY;

EID: 84873986121     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2012.12.018     Document Type: Article

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