Packaging of electronic modules through completely dry process

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 950-955

  Maekawa, Katsuhiro ^a   Mita, Mamoru ^b   Yamasaki, Kazuhiko ^a   Niizeki, Tomotake ^c   Matsuba, Yorishige ^d   Terada, Nobuto ^d   Saito, Hiroshi ^d  

^a IBARAKI UNIVERSITY   (Japan)

^b Mita Engineering Office   (Japan)

^c JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

^d Harima Chemicals Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ARSENIC COMPOUNDS; CHEMICAL SENSORS; CHIP SCALE PACKAGES; COMPUTER NETWORKS; COPPER; ELECTRONIC EQUIPMENT MANUFACTURE; INK; LASER HEATING; LASERS; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; NEODYMIUM LASERS; ORGANIC COMPOUNDS; ORGANIC SOLVENTS; POLYIMIDES; POLYMERS; PRINTING; PULSED LASER APPLICATIONS; PULSED LASER DEPOSITION; SEPARATION; SUBSTRATES;

ELECTRONIC COMPONENTS; ELECTRONIC MODULES; INK-JET PRINTING; LASER SINTERING;

SILVER;

EID: 51349159799     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550090     Document Type: Conference Paper

References (8)

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