SCOPUS 정보 검색 플랫폼

Volumn 48, Issue 8 Part 2, 2009, Pages

Effect of temperature/humidity treatment conditions on interfacial adhesion energy between inkjet-printed Ag and polyimide

(2) Park, Sung Cheol a Park, Young Bae a

a Andong National University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDINGS; FLEXIBLE PRINTED CIRCUIT BOARDS; HYDROLYSIS REACTION; INK-JET PRINTING; INTERFACIAL ADHESION ENERGY; INTERFACIAL BONDING; METAL SURFACES; METALLIZATIONS; PEAK AREA; PEEL TESTS; POLYIMIDE FILM; QUANTITATIVE CORRELATION; TREATMENT CONDITIONS; WATER MOLECULE; X RAY PHOTOEMISSION SPECTROSCOPY; CHEMICAL PRE-TREATMENT; COHESIVE FAILURES; ELECTROLESS-PLATED NI; ETHYLENE DIAMINE; PRETREATMENT CONDITIONS; TREATMENT TIME; WET CHEMICALS;

CHEMICAL BONDS; EMISSION SPECTROSCOPY; PHOTODEGRADATION; POLYIMIDES; POLYMERIC FILMS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SILVER; ADHESION;

ADHESION; NEMATIC LIQUID CRYSTALS;

EID: 77952691009 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.48.08HL02 Document Type: Article

Times cited : (9)

References (16)

1
- 0020126693
- C. W. Ho, D. A. Chance, C. H. Bajorek, and R. E. Acosta: IBM J. Res. Dev. 26 (1982) 286.
- (1982) IBM J. Res. Dev. , vol.26 , pp. 286
- Ho, C.W.¹ Chance, D.A.² Bajorek, C.H.³ Acosta, R.E.⁴

2
- 0035025694
- C. D. Dimitrakopoulos and D. J. Mascaro: IBM J. Res. Dev. 45 (2001) 11.
- (2001) IBM J. Res. Dev. , vol.45 , pp. 11
- Dimitrakopoulos, C.D.¹ Mascaro, D.J.²

3
- 10644241812
- D. Redinger, S. Moleasa, S. Yin, R. Farschi, and V. Subramanian: IEEE Trans. Electron Devices 51 (2004) 1978.
- (2004) IEEE Trans. Electron Devices , vol.51 , pp. 1978
- Redinger, D.¹ Moleasa, S.² Yin, S.³ Farschi, R.⁴ Subramanian, V.⁵

4
- 0030381824
- E. C. Ahn, J. Yu, and I. S. Park: J. Adhes. Sci. Technol. 10 (1996) 1343.
- (1996) J. Adhes. Sci. Technol. , vol.10 , pp. 1343
- Ahn, E.C.¹ Yu, J.² Park, I.S.³

5
- 21344484418
- A. C. Callegari, H. M. Clearfield, B. K. Furman, T. G. Graham, and D. Neugroschl: J. Vac. Sci. Technol. A 12 (1994) 185.
- (1994) J. Vac. Sci. Technol. A , vol.12 , pp. 185
- Callegari, A.C.¹ Clearfield, H.M.² Furman, B.K.³ Graham, T.G.⁴ Neugroschl, D.⁵

6
- 0001389639
- D. D. Denton, M. C. Buncick, and H. Pranjoto: J. Mater. Res. 6 (1991) 2747.
- (1991) J. Mater. Res. , vol.6 , pp. 2747
- Denton, D.D.¹ Buncick, M.C.² Pranjoto, H.³

7
- 0042453238
- D. C. Hu and H. C. Chen: J. Mater. Sci. 27 (1992) 5262.
- (1992) J. Mater. Sci. , vol.27 , pp. 5262
- Hu, D.C.¹ Chen, H.C.²

8
- 0023843976
- K. S. Kim and N. Aravas: Int. J. Solid Struct. 24 (1988) 417.
- (1988) Int. J. Solid Struct. , vol.24 , pp. 417
- Kim, K.S.¹ Aravas, N.²

9
- 0028383622
- A. J. Kinloch, C. C. Lau, and J. G. Williams: Int. J. Fract. 66 (1994) 45.
- (1994) Int. J. Fract. , vol.66 , pp. 45
- Kinloch, A.J.¹ Lau, C.C.² Williams, J.G.³

10
- 0001244685
- Y. B. Park, I. S. Park, and J. Yu: Mater. Sci. Eng. A 266 (1999) 261.
- (1999) Mater. Sci. Eng. A , vol.266 , pp. 261
- Park, Y.B.¹ Park, I.S.² Yu, J.³

11
- 0039842082
- Y. B. Park and J. Yu: Met. Mater. Int. 7 (2001) 123.
- (2001) Met. Mater. Int. , vol.7 , pp. 123
- Park, Y.B.¹ Yu, J.²

12
- 0037144298
- J. Y. Song and J. Yu: Acta Mater. 50 (2002) 3985.
- (2002) Acta Mater. , vol.50 , pp. 3985
- Song, J.Y.¹ Yu, J.²

13
- 64549150641
- S. C. Park and Y. B. Park: J. Korean Phys. Soc. 54 (2009) 1288.
- (2009) J. Korean Phys. Soc. , vol.54 , pp. 1288
- Park, S.C.¹ Park, Y.B.²

14
- 84945608525
- L. J. Gerenser: J. Vac. Sci. Technol. A 8 (1990) 3682.
- (1990) J. Vac. Sci. Technol. A , vol.8 , pp. 3682
- Gerenser, L.J.¹

15
- 0009087041
- M. Amagai, M. Ohsumi, E. Kawasaki, R. Baumann, and H. Kitagawa: Proc. IEEE/IRPS, 1994, p. 101.
- (1994) Proc. IEEE/IRPS , pp. 101
- Amagai, M.¹ Ohsumi, M.² Kawasaki, E.³ Baumann, R.⁴ Kitagawa, H.⁵

16
- 33845907926
- T. Miyamura and J. Koike: Mater. Sci. Eng. A 445-446 (2007) 620.
- (2007) Mater. Sci. Eng. A , vol.445-446 , pp. 620
- Miyamura, T.¹ Koike, J.²

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