Study of high-tech process furnace using inherently safer design strategies (II). Deposited film thickness model

Journal of Loss Prevention in the Process Industries

Volumn 26, Issue 1, 2013, Pages 225-235

  Chen, Chun Yu ^a   Chang, Kuo Chi ^b   Lu, Chih Cheng ^b   Wang, Gwo Bin ^c  

^a VANUNG UNIVERSITY   (Taiwan)

^b NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^c CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

Inherently safer design; LPCVD furnace; Plant inherent safety; Silane supply system; Thickness model of wafer deposition

Indexed keywords

AFFECTING FACTORS; APPLICATION LEVEL; COMMERCIAL PROCESS; COMPREHENSIVE DESIGNS; CONVERSION RATES; DEPOSITED FILMS; EXPERIMENTAL VALUES; FURNACE TEMPERATURES; GAS CABINETS; HEATING ZONE; HIGH-PRESSURE CYLINDERS; INHERENT SAFETY; INHERENTLY SAFER; INHERENTLY SAFER DESIGN; LIMITATION OF EFFECTS; MOLE FRACTION; MULTIPLE CIRCUITS; OPTIMAL METHODS; PROCESS CAPACITY; PROCESS CONDITION; REACTANT GAS; SUPPLY SYSTEM; THERMAL MODEL; THICKNESS GROWTH; THICKNESS MODEL; THIN-FILM DEPOSITIONS; VOLUME FLOW RATE;

CHEMICAL VAPOR DEPOSITION; CYLINDERS (SHAPES); DESIGN; FILM GROWTH; FLOW RATE; FURNACES; GAS SUPPLY; HIGH PRESSURE EFFECTS; ONTOLOGY; THIN FILMS;

FILM THICKNESS;

EID: 84872499348     PISSN: 09504230     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jlp.2012.11.004     Document Type: Article

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