Investigation of a nanofabrication process to achieve high aspect-ratio nanostructures on a quartz substrate

Nanotechnology

Volumn 24, Issue 1, 2013, Pages

  Mohamed, K ^a   Alkaisi, M M ^b  

^a SCHOOL OF PHYSICS   (Malaysia)

^b UNIVERSITY OF CANTERBURY   (New Zealand)

Author keywords

[No Author keywords available]

Indexed keywords

BILAYER RESISTS; ETCH MASK; ETCH RATES; ETCHING PROCESS; FEATURE SIZES; FLOWRATE RATIO; HIGH ASPECT RATIO; NANOFABRICATION PROCESS; NICHROME; PATTERN TRANSFERS; PATTERNING TOOLS; PLASMA ETCHING PROCESS; QUARTZ SUBSTRATE; RADIO-FREQUENCY POWER; REACTIVE ION; RESIST PATTERN; ROOM TEMPERATURE; SUB-100 NM; VERTICAL SIDE WALL;

ACETONE; ELECTRON BEAM LITHOGRAPHY; ESTERS; NANOSTRUCTURES; PHOTORESISTS; PLASMA ETCHING; QUARTZ; SUBSTRATES;

ASPECT RATIO;

EID: 84870490729     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/24/1/015302     Document Type: Article

References (12)

1. Villa-Comamala J, Gorelick S, Guzenko V A, Farm E, Ritala M and David C 2010 Dense high aspect ratio hydrogen silsesquioxane nanostructures by 100 keV electron beam lithography Nanotechnology 21 285305
2. Howells M, Jacobsen C, Warwick T and van den Bos A 2007 Principles and applications of zone plate x-ray microscopes Science of Microscopy (New York: Springer) chapter 13 pp 835-926
3. Huang M-J, Yang C-R, Lee R-T and Chiou Y-C 2009 Fabrication of a fuel cell electrode with a high-aspect-ratio nanostructure array J. Micromech. Microeng. 045003
4. Mohamed K 2009 PhD Thesis University of Canterbury
5. Laemer F and Schilp A 1994 Method of Anisotropically Etching Silicon US Patent No. 5.501.893 of Robert Bosch GmbH
6. Laemer F, Franssila S, Sainiemi L and Kolari K 2010 Deep reactive-ion etching Handbook of Silicon Based MEMS Materials and Technologies ed V Lindroos, M Tilli, A Lehto and T Motooka (Amsterdam: Elsevier)
7. Rosolen G C, Wong T K S and Welland M E 1992 Study of reactive ion etched nanometer size trenches using a combined scanning microscope and scanning tunnelling microscope Nanotechnology 3 49-53
8. Mohamed K, Alkaisi M M and Blaikie R J 2009 Surface charging suppression using PEDOT/PSS in the fabrication of three dimensional structures on quartz substrate Microelectron. Eng. 86 535-8
9. Chan C M, Ko T M and Hiraoka H 1996 Polymer surface modification by plasmas and photons Surf. Sci. Rep. 24 1-54 (Pubitemid 126383843)
10. Coulburn J W 2000 Some fundamental aspects of plasma-assisted etching Handbook of Advanced Plasma Processing Techniques ed R J Shul and S J Pearton (Berlin: Springer) p 24
11. Cheam D D and Bergstrom P L 2008 Optimization of focus ion beam patterning and reactive ion etching process of quartz imprint template for ultra violet nanoimprint lithography 26th Army Science Conference (ASC) (JW Marriot Grande Lakes, Orlando, Florida,)
12. Joubert O, Oehrlein G S and Zhang Y 1994 Fluorocarbon high density plasma. V. Influence of aspect ratio on the etch rate of silicon dioxide in an electron cyclotron resonance plasma J. Vac. Sci. Technol. A 12 658-64 (Pubitemid 24791606)